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74ACT16827 Datasheet PDF

Texas Instruments 74ACT16827

The 74ACT16827 is packaged in TI’s shrink small-outline package, which provides twice the I/O pin count and functionality of standard small-outline packages in the same printedcircuit-board area. The 74ACT16827 is characterized for operation from –40°C to 85°C.
Part No. 74ACT16827
Datasheet 74ACT16827 Download
Manufacturer
Texas Instruments
Description 20-BIT BUFFERS/DRIVERS
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74ACT16827 datasheet page 1 preview
54ACT16827, 74ACT16827 20-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS SCAS163A – JUNE 1990 – REVISED APRIL 1996 D Members of the Texas Instruments Widebus ™ Family D Inputs Are TTL-Voltage Compatible D 3-State Outputs Drive Bus Lines Directly D Flow-Through Architecture Optimizes PCB Layout D Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise D EPIC™ (Enhanced-Performance Implanted CMOS) 1-µm Process D 500-mA Typical Latch-Up Immunity at 125°C D Package Options Include Plastic 300-mil Shrink Small-Outline (DL) Packages Using 25-mil Center-to-Center Pin Spacings and 380-mil Fine-Pitch Ceramic Flat (WD) Packages Using 25-mil Center-to-Center Pin Spacings description The ’ACT16827 are noninverting 20-bit buffers composed of two 10-bit sections with separate output-enable signals. For either 10-bit buffer section, the two output-enable (1OE1 and 1OE2 or 2OE1 and 2OE2) inputs must both be low for the corresponding Y outputs to be active. If either output-enable input is high, the outputs of that 10-bit buffer section are in the high-impedance state.
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