FEATURES
D Controlled Baseline − One Assembly/Test Site, One Fabrication Site D Extended Temperature Performance of −40°C to 85°C D Enhanced Diminishing Manufacturing Sources (DMS) Support D Enhanced Product-Change Notification D Qualification Pedigree† D High-Performance, Low-Power, Fixed-Point 320C55x Digital Signal Processor (DSP) − 5-ns Instruction Cycle Time − 200-MHz Clock Rate − One/Two Instructions Executed per Cycle − Dual Multipliers (Up to 400 Million Multiply-Accumulates Per Second (MMACS)) − Two Arithmetic/Logic Units − One Internal Program Bus − Three Internal Data/Operand Read Buses − Two Internal Data/Operand Write Buses D Instruction Cache (24K Bytes) D 160K x 16-Bit On-Chip RAM Composed of: − Eight Blocks of 4K × 16-Bit Dual-Access RAM (DARAM) (64K Bytes) − 32 Blocks of 4K × 16-Bit Single-Access RAM (SARAM) (256K Bytes) D 16K × 16-Bit On-Chip ROM (32K Bytes) FEATURES
D 8M × 16-Bit Maximum Addressable External Memory Space D 32-Bit External Memory Interface (EMIF) Wit...
Texas Instruments
