Click to expand full text
D State-of-the-Art EPIC-ΙΙB™ BiCMOS Design
Significantly Reduces Power Dissipation
D Latch-Up Performance Exceeds 500 mA Per
JEDEC Standard JESD-17
D ESD Protection Exceeds 2000 V Per
MIL-STD-883, Method 3015; Exceeds 200 V
Using Machine Model (C = 200 pF, R = 0)
D Typical VOLP (Output Ground Bounce) < 1 V
at VCC = 5 V, TA = 25°C
D High-Drive Outputs (–32-mA IOH, 64-mA IOL) D Package Options Include Plastic
Small-Outline (DW), Shrink Small-Outline
(DB), and Thin Shrink Small-Outline (PW)
Packages, Ceramic Chip Carriers (FK),
Plastic (N) and Ceramic (J) DIPs, and
Ceramic Flat (W) Package
SN54ABT241, SN74ABT241A OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS
SCBS184D – JANUARY 1991 – REVISED JANUARY 1997
SN54ABT241 . . . J OR W PACKAGE SN74ABT241A . . .
SN54ABT241 Datasheet
