Datasheet Summary
- State-of-the-Art BiCMOS Design
Significantly Reduces ICCZ
- P-N-P Inputs Reduce DC Loading
- ESD Protection Exceeds 2000 V
Per MIL-STD-883C, Method 3015
- 3-State Outputs Drive Bus Lines or Buffer
Memory Address Registers
- Package Options Include Plastic
Small-Outline (DW) and Shrink
Small-Outline (DB) Packages, Ceramic Chip
Carriers (FK) and Flatpacks (W), and
Standard Plastic and Ceramic 300-mil DIPs
(J, N)
SN54BCT244, SN74BCT244 OCTAL BUFFERS/DRIVERS
WITH 3ĆSTATE OUTPUTS
SCBS006E
- OCTOBER 1987
- REVISED APRIL 1994
SN54BCT244 . . . J OR W PACKAGE SN74BCT244 . . . DB OR DW OR N PACKAGE
(TOP VIEW)
1OE 1 1A1 2 2Y4 3 1A2 4 2Y3 5 1A3 6 2Y2 7 1A4 8 2Y1 9 GND 10
20 VCC 19 2OE 18 1Y1 17...