SN74AUP1G80
SN74AUP1G80 is Low-Power Single Positive-Edge-Triggered D-Type Flip-Flop manufactured by Texas Instruments.
Features
- 1 Latch-Up Performance Exceeds 100 m A Per JESD 78, Class II
- ESD Performance Tested Per JESD 22
- 2000-V Human-Body Model (A114-B, Class II)
- 1000-V Charged-Device Model (C101)
- Available in the Texas Instruments Nano Star™ Package
- Low Static-Power Consumption (ICC = 0.9 µA Maximum)
- Low Dynamic-Power Consumption (Cpd = 4.3 p F Typical at 3.3 V)
- Low Input Capacitance (Ci = 1.5 p F Typical)
- Low Noise
- Overshoot and Undershoot <10% of
- Ioff Supports Partial-Power-Down Mode Operation
- Schmitt-Trigger Action Allows Slow Input
Transition and Better Switching Noise Immunity at the Input (Vhys = 250 m V Typical at 3.3 V)
- Wide Operating VCC Range of 0.8 V to 3.6 V
- Optimized for 3.3-V Operation
- 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
- tpd = 4.4 ns Maximum at 3.3 V
- Suitable for Point-to-Point Applications
2 Applications
- Home Automation
- Factory Automation
- Test and Measurement
- Enterprise Switching
- Tele Infrastructure
- Personal Electronics
- White Goods
3 Description
The AUP family is TI's premier solution to the industry's low-power needs in battery-powered portable applications. This family assures a low staticand dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life (see AUP
- The Lowest-Power Family). This product also maintains excellent signal integrity (see Excellent Signal Integrity).
This is a single positive-edge-triggered D-type flipflop. When data at the data (D) input meets the setup time requirement, the data is transferred to the Q output on the positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not directly related to the rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without affecting the levels at the outputs.
Nano Star™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for...