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TMP007 - Infrared Thermopile Sensor

General Description

The TMP007 is a fully-integrated microelectromechanical system (MEMS) thermopile sensor that measures the temperature of an object without direct contact.

The thermopile absorbs passive infrared energy from an object at wavelengths between 4 um to 16 um within the end-user defined field of view.

Key Features

  • 1 Integrated MEMS Thermopile for Noncontact Temperature Sensing.
  • 14-Bit Local Temperature Sensor for Cold Junction Reference.
  • ±1°C (max) from 0°C to +60°C.
  • ±1.5°C (max) from.
  • 40°C to +125°C.
  • Integrated Math Engine.
  • Directly Read Object Temperature.
  • Programmable Alerts.
  • Nonvolatile Memory for Storing Calibration Coefficients.
  • Transient Correction.
  • Two-Wire Serial Interface Options.
  • I2C and S.

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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Product Folder Sample & Buy Technical Documents Tools & Software Support & Community TMP007 SBOS685C – APRIL 2014 – REVISED JULY 2015 TMP007 Infrared Thermopile Sensor with Integrated Math Engine 1 Features •1 Integrated MEMS Thermopile for Noncontact Temperature Sensing • 14-Bit Local Temperature Sensor for Cold Junction Reference – ±1°C (max) from 0°C to +60°C – ±1.5°C (max) from –40°C to +125°C • Integrated Math Engine – Directly Read Object Temperature – Programmable Alerts – Nonvolatile Memory for Storing Calibration Coefficients – Transient Correction • Two-Wire Serial Interface Options – I2C and SMBus Compatible – Eight Programmable Addresses • Low Power – Supply: 2.5 V to 5.5 V – Active Current: 270 μA (typ) – 2-µA Shutdown (max) • Compact Package – 1.9-mm × 1.9-mm × 0.