Texas Instruments TMP007
The TMP007 is a fully-integrated microelectromechanical system (MEMS) thermopile sensor that measures the temperature of an object without direct contact. The thermopile absorbs passive infrared energy from an object at wavelengths between 4 um to 16 um within the end-user defined field of view. The internal math engine combines the corresponding change in voltage across the thermopile with the internal cold-junction reference temperature sensor to calculate the target object temperature.FEATURES
●1 Integrated MEMS Thermopile for Noncontact Temperature Sensing● 14-Bit Local Temperature Sensor for Cold Junction Reference – ±1°C (max) from 0°C to +60°C – ±1.5°C (max) from –40°C to +125°C
● Integrated Math Engine – Directly Read Object Temperature – Programmable Alerts – Nonvolatile Memory for Storing Calibration Coefficients – Transient Correction
● Two-Wire Serial Interface Options – I2C and SMBus Compatible – Eight Programmable Addresses
● Low Power – Supply: 2.5 V to 5.5 V – Active Current: 270 μA (typ) – 2-µA Shutdown (max)
● Compact Package – 1.9-mm × 1.9-mm × 0.625-mm DSBGA 2
APPLICATIONS
● Noncontact Temperature Sensing – Case Temperature – Laser Printers – Power Relays – Health and Beauty – HVAC Comfort Optimization● Gas Concentration
● Flame Detection 3
DESCRIPTION
The TMP007 also provides nonvolatile memory for storing calibration coefficients. The TMP007 is designed with portability and power in mind, and can easily be placed in the tightest of spaces while using standard surface-mount assembly processes.