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TMP007 Datasheet Infrared Thermopile Sensor

Manufacturer: Texas Instruments

Overview: Product Folder Sample & Buy Technical Documents Tools & Software Support & munity TMP007 SBOS685C – APRIL 2014 – REVISED JULY 2015 TMP007 Infrared Thermopile Sensor with Integrated Math Engine.

General Description

The TMP007 is a fully-integrated microelectromechanical system (MEMS) thermopile sensor that measures the temperature of an object without direct contact.

The thermopile absorbs passive infrared energy from an object at wavelengths between 4 um to 16 um within the end-user defined field of view.

The internal math engine bines the corresponding change in voltage across the thermopile with the internal cold-junction reference temperature sensor to calculate the target object temperature.

Key Features

  • 1 Integrated MEMS Thermopile for Noncontact Temperature Sensing.
  • 14-Bit Local Temperature Sensor for Cold Junction Reference.
  • ±1°C (max) from 0°C to +60°C.
  • ±1.5°C (max) from.
  • 40°C to +125°C.
  • Integrated Math Engine.
  • Directly Read Object Temperature.
  • Programmable Alerts.
  • Nonvolatile Memory for Storing Calibration Coefficients.
  • Transient Correction.
  • Two-Wire Serial Interface Options.
  • I2C and S.

More Datasheets from Texas Instruments

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TMP100-Q1 Temperature Sensor
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