TPS50301-HT Datasheet | Texas Instruments

Features - 1 Peak Efficiency: 95% (VO = 3.3 V) - Integrated 55-mΩ/50-mΩ MOSFETs - Split Power Rail: 1.6 to 6.3 V on PVIN - Power Rail: 3 to 6.3 V on VIN - 3A - Flexible Switching Frequency Options: - 100-k Hz to 1-MHz Adjustable Internal Oscillator - External Sync Capability: 100 k Hz to 1 MHz - SYNC Pin can be Configured as a 500-k Hz Output for Master/Slave Applications - 0.795-V ±1.258% Voltage Reference at 25°C - Monotonic Start-Up into Prebiased Outputs - Adjustable Slow Start and Power Sequencing - Power Good Output Monitor for Undervoltage and Overvoltage - Adjustable Input Undervoltage Lockout (UVLO) - 20-Pin Thermally-Enhanced Ceramic Flatpack Package (HKH) - See the Tools & Software Tab - Create a custom design using the TPS50301-HT with the WEBENCH® Power Designer 2 Applications - Point of Load Regulation - Down-Hole Drilling - Supports Harsh Environment Applications - Available in Extreme (- 55°C to 210°C) Temperature Range(1) - TI's High Temperature Products use Highly Optimized Silicon (Die) Solutions With Design and Process Enhancements to Maximize Performance over Extended Temperatures 3 Description The TPS50301-HT is a 6.3-V, 3-A synchronous stepdown converter, which is optimized for small designs through high efficiency and integrating the high-side and low-side MOSFETs. Further space savings are achieved through current mode control, which reduces ponent count, and a high switching frequency, reducing the inductor's footprint. The devices are offered in a thermally enhanced 20-pin ceramic, dual in-line flatpack package. Device Information(2) PART NUMBER PACKAGE BODY SIZE (NOM) CFP (20) KGD(3) 7.38 × 12.70 mm N/A(4) (1) Custom temperature ranges are available. (2) For all available packages, see the orderable addendum at the end of the data sheet. (3) Known good die. (4) Bare die in waffle pack. Efficiency (p.u.) Efficiency vs Load Current, VIN = 5...