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BC807-25QC-Q - 500mA PNP general-purpose transistors

Download the BC807-25QC-Q datasheet PDF. This datasheet also covers the BC807-16QC-Q variant, as both devices belong to the same 500ma pnp general-purpose transistors family and are provided as variant models within a single manufacturer datasheet.

General Description

PNP general-purpose transistor in an ultra small DFN1412D-3 (SOT8009) leadless SurfaceMounted Device (SMD) plastic package with side-wettable flanks.

Table 1.

Key Features

  • High power dissipation capability.
  • High current.
  • Three current gain selections.
  • Suitable for Automatic Optical Inspection (AOI) of solder joint.
  • Smaller footprint compared to conventional leaded SMD packages.
  • Low package height of 0.5 mm.
  • Qualified according to AEC-Q101 and recommended for use in automotive.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (BC807-16QC-Q-nexperia.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number BC807-25QC-Q
Manufacturer Nexperia
File Size 327.06 KB
Description 500mA PNP general-purpose transistors
Datasheet download datasheet BC807-25QC-Q Datasheet

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Other Datasheets by Nexperia

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BC807-25QCH-Q 500mA PNP general-purpose transistors
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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
BC807QC-Q series 45 V, 500 mA PNP general-purpose transistors Rev. 2 — 4 May 2021 Product data sheet 1. General description PNP general-purpose transistor in an ultra small DFN1412D-3 (SOT8009) leadless SurfaceMounted Device (SMD) plastic package with side-wettable flanks. Table 1. Product overview Type number Package Name BC807-16QC-Q DFN1412D-3 BC807-25QC-Q BC807-40QC-Q JEDEC MO-340CA Version SOT8009 NPN complement BC817-16QC-Q BC817-25QC-Q BC817-40QC-Q 2. Features and benefits • High power dissipation capability • High current • Three current gain selections • Suitable for Automatic Optical Inspection (AOI) of solder joint • Smaller footprint compared to conventional leaded SMD packages • Low package height of 0.