PHPT61002NYC Overview
NPN high power bipolar transistor in a SOT669 (LFPAK56) Surface-Mounted Device (SMD) power plastic package.
PHPT61002NYC Key Features
- High thermal power dissipation capability
- High temperature
PHPT61002NYC Applications
- Reduced Printed Circuit Board (PCB) requirements paring to transistors in DPAK
- High energy efficiency due to less heat generation