Datasheet4U Logo Datasheet4U.com

PMEG3010BEP - MEGA Schottky barrier rectifier

Description

Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a SOD128 small and flat lead SurfaceMounted Device (SMD) plastic package.

2.

Features

  • Average forward current: IF(AV) ≤ 1 A.
  • Reverse voltage: VR ≤ 30 V.
  • Low forward voltage.
  • High power capability due to clip-bond technology.
  • AEC-Q101 qualified.
  • Small and flat lead SMD plastic package.
  • Capable for reflow and wave soldering 3.

📥 Download Datasheet

Datasheet preview – PMEG3010BEP

Datasheet Details

Part number PMEG3010BEP
Manufacturer nexperia
File Size 224.51 KB
Description MEGA Schottky barrier rectifier
Datasheet download datasheet PMEG3010BEP Datasheet
Additional preview pages of the PMEG3010BEP datasheet.

📁 Similar Datasheet

  • PMEG3010BEP - 1A Low Vf MEGA Schottky Barrier Rectifier (NXP)
  • PMEG3010BEA - 1A very low VF MEGA Schottky barrier rectifier (NXP Semiconductors)
  • PMEG3010BER - 1A Low Vf MEGA Schottky Barrier Rectifier (NXP)
  • PMEG3010BEV - 1A very low VF MEGA Schottky barrier rectifier (NXP Semiconductors)
  • PMEG3010AESA - MEGA Schottky barrier rectifier (NXP)
  • PMEG3010AESB - MEGA Schottky barrier rectifier (NXP)
  • PMEG3010CEH - MEGA Schottky barrier rectifier (NXP)
  • PMEG3010CEJ - MEGA Schottky barrier rectifier (NXP)
  • PMEG3010EB - MEGA Schottky barrier rectifier (NXP)
  • PMEG3010EH - 1A very low VF MEGA Schottky barrier rectifiers (NXP Semiconductors)
Other Datasheets by nexperia

Full PDF Text Transcription

Click to expand full text
PMEG3010BEP 1 A low Vf MEGA Schottky barrier rectifier 26 March 2018 Product data sheet 1. General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a SOD128 small and flat lead SurfaceMounted Device (SMD) plastic package. 2. Features and benefits • Average forward current: IF(AV) ≤ 1 A • Reverse voltage: VR ≤ 30 V • Low forward voltage • High power capability due to clip-bond technology • AEC-Q101 qualified • Small and flat lead SMD plastic package • Capable for reflow and wave soldering 3. Applications • Low voltage rectification • High efficiency DC-to-DC conversion • Switch Mode Power Supply (SMPS) • Reverse polarity protection • Low power consumption applications 4.
Published: |