onsemi DAN222G
the DAN222 3 Datasheet pdf - DAN222G PACKAGE DIMENSIONS SC-75/SOT-416 CASE 463--01 ISSUE F -E2 3 NOTES: 1.FEATURES
CATHODE 3● Fast trr
● Low CD
● These Devices are Pb--Free, Halogen Free/BFR Free and are RoHS Compliant 1 ANODE 2
MAXIMUM RATINGS
(TA = 25C) Rating Reverse Voltage Peak Reverse Voltage Forward Current Peak Forward Current Peak Forward Surge Current (Note 1) Symbol VR VRM IF IFM IFSM Value 80 80 100 300 2.0 Unit Vdc Vdc mAdc mAdc Adc 1 SC-75/SOT-416 CASE 463 STYLE 3 THERMAL CHARACTERISTICS Characteristic Power Dissipation Junction Temperature Storage Temperature Range Symbol PD TJ Tstg Max 150 150 --55 to +150 Unit mW C/W C MARKING DIAGRAM N9 M G G 1 N9 = Specific Device Code M = Date Code* G = Pb--Free Package (Note: Microdot may be in either location) *Date Code orientation may vary depending upon manufacturing location. Stresses exceedingMAXIMUM RATINGS
may damage the device.MAXIMUM RATINGS
are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.