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FDC6304P Datasheet PDF

onsemi FDC6304P

This very high density process is tailored to minimize on-state resistance at low gate drive conditions. This device is designed especially for application in battery power applications such as notebook computers and cellular phones.
Part No. FDC6304P
Datasheet FDC6304P Download
Manufacturer
onsemi
Description Dual P-Channel MOSFET
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FDC6304P datasheet page 1 preview

GENERAL DESCRIPTION

These P-Channel enhancement mode field effect transistor are produced using ON Semiconductor's proprietary, high cell density, DMOS technology. This device has excellent on-state resistance even at gate drive voltages as low as 2.5 volts.

FEATURES

-25 V, -0.46 A continuous, -1.0 A Peak. RDS(ON) = 1.5 Ω @ VGS= -2.7 V RDS(ON) = 1.1 Ω @ VGS = -4.5 V. Very low level gate drive requirements allowing direct operation in 3V circuits. VGS(th) < 1.5 V. Gate-Source Zener for ESD ruggedness. >6kV Human Body Model. SOT-23 SuperSOTTM-6 Mark: .304 SuperSOTTM-8 SO-8 SOT-223 SOIC-16 4 3 5 2 6 1

ABSOLUTE MAXIMUM RATINGS

TA = 25oC unless other wise noted Symbol Parameter VDSS Drain-Source Voltage VGSS Gate-Source Voltage ID Drain Current - Continuous - Pulsed PD Maximum Power Dissipation (Note 1a) (Note 1b) TJ,TSTG ESD Operating and Storage Temperature Range Electrostatic Discharge Rating MIL-STD-883D Human Body Model (100pf / 1500 Ohm) THERMAL CHARACTERISTICS RθJA Thermal Resistance, Junction-to-Ambient (Note 1a) RθJC Thermal Resistance, Junction-to-Case (Note 1) © 1997 September Components Industries, LLC.
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