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FDC642P Datasheet PDF

onsemi FDC642P

This P-Channel 2.5V specified MOSFET is produced using ON Semicondcutor’s advanced PowerTrench® process that has been especially tailored to minimize on-state resistance and yet maintain low gate charge for superior switching performance. These devices have been designed to offer exceptional power dissipation in a very small footprint for applications where the larger packages are impractical.
Part No. FDC642P
Datasheet FDC642P Download
Manufacturer
onsemi
Description P-Channel MOSFET
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FDC642P datasheet page 1 preview

FEATURES

GENERAL DESCRIPTION

„ Max rDS(on) = 65 mΩ at VGS = -4.5 V, ID = -4.0 A „ Max rDS(on) = 100 mΩ at VGS = -2.5 V, ID = -3.2 A „ Fast switching speed „ Low gate charge (11nC typical) „ High performance trench technology for extremely low rDS(on) „ SuperSOTTM-6 package: small footprint (72% smaller than standard SO-8); low profile (1 mm thick) „ Termination is Lead-free and RoHS Compliant

APPLICATIONS

„ Load switch „ Battery protection „ Power management D D D D G S MOSFET

MAXIMUM RATINGS

TC = 25°C unless otherwise noted Symbol VDS VGS ID PD TJ, TSTG Parameter Drain to Source Voltage Gate to Source Voltage -Continuous -Pulsed TA = 25°C Power Dissipation Power Dissipation Operating and Storage Junction Temperature Range Thermal Characteristics (Note 1a) ( Note 1a) (Note 1b) Ratings -20 ±8 -4.0 -20 1.6 0.8 -55 to + 150 Units V V A W °C RθJA Thermal Resistance, Junction to Ambient Package Marking and Ordering Information (Note 1a) 78 °C/W Device Marking .642 Device FDC642P Package SSOT-6TM Reel Size 7 ’’ Tape Width 8 mm Quantity 3000 units ©2010 Semiconductor Components Industries, LLC.
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