| Part Number | BAT43 |
|---|---|
| Manufacturer | Taiwan Semiconductor |
| Overview | Multiple manufacture source Green compound Define manufacture source Green compound PACKAGE OUTLINE DIMENSION DIM. A B C D Unit (mm) Min Max 0.34 0.60 2.90 5.08 25.40 38.10 1.30 2.28 Unit (inch) M. - Low forward voltage drop - Through-hole device type mounting - Hermetically sealed glasss - Compression bonded construction - Solder hot dip tin (Sn) lead finish - All external surfaces are corrosion resistant and leads are readily solderable DO-35 Hermetically Sealed Glass MAXIMUM RATINGS AND E. |