| Part Number | FP100 Datasheet |
|---|---|
| Manufacturer | Filtronic Compound Semiconductors |
| Overview |
AND APPLICATIONS
DIE SIZE: 16.5 x 16.5 mils (420 x 420 µm) DIE THICKNESS: 3.9 mils (100 µm typ.) BONDING PADS: 3.3 x 3.5 mils (85 x 90 µm typ.)
The FP100 is an Aluminum Gallium Arsenide / Indium Gal.
* 14 dBm P-1dB at 12 GHz * 9 dB Power Gain at 12 GHz * 3.0 dB Noise Figure at 12 GHz * DESCRIPTION AND APPLICATIONS DIE SIZE: 16.5 x 16.5 mils (420 x 420 µm) DIE THICKNESS: 3.9 mils (100 µm typ.) BONDING PADS: 3.3 x 3.5 mils (85 x 90 µm typ.) The FP100 is an Aluminum Gallium Arsenide / Indium Ga. |