The US1KF is a SURFACE MOUNT ULTRA FAST RECTIFIER.
| Mount Type | Surface Mount |
|---|---|
| Height | 1.43 mm |
| Max Operating Temp | 150 °C |
| Min Operating Temp | -55 °C |
| Part Number | US1KF Datasheet |
|---|---|
| Manufacturer | KD |
| Overview |
US1AF THRU US1MF
SURFACE MOUNT ULTRA FAST RECTIFIER
Reverse Voltage - 50 to 1000 Volts Forward Current - 1.0 Ampere
FEATURES
● Glass Passivated Die Construction ● The plastic package carries Underwri.
* Glass Passivated Die Construction * The plastic package carries Underwriters Laboratory Flammability Classification 94V-0 * For surface mounted applications * Low reverse leakage * Built-in strain relief,ideal for automated placement * High forward surge current capability * High temperature solde. |
| Part Number | US1KF Datasheet |
|---|---|
| Description | SURFACE MOUNT ULTRA FAST RECOVERY RECTIFIER |
| Manufacturer | MIC |
| Overview | 1 Cathode 2 Anode 12 Top View Marking Code: US1A~US1M Simplified outline SMAF and symbol 0$;,0805$7,1*6$1'(/(&75,&$/&+$5$&7(5,67,&6 ͈ 5DWLQJVDW&DPELHQWWHPSHUDWXUHXQOHVVRWKHUZLVHVSHFLI. . |
| Part Number | US1KF Datasheet |
|---|---|
| Description | 1.0A Ultra Fast Recovery Rectifier |
| Manufacturer | DIOFIT |
| Overview |
US1AF THRU US1MF 1.0A Ultra Fast Recovery Rectifier
1. Package Method: SMAF Dimension:
2. Features For surface mounted applications in order to optimize board space Easy pick and place .
* For surface mounted applications in order to optimize board space * Easy pick and place * Ultrafast recovery times for high efficiency * Glass Passivated junction * Lead-free & halogen-free parts ,ROHS compliant 3. Mechanical Data * Epoxy: UL94V-0 rated flame retardant * Case: Molded plastic over. |
| Part Number | US1KF Datasheet |
|---|---|
| Description | Surface Mount Ultrafast Recovery Rectifier |
| Manufacturer | SEMTECH |
| Overview |
US1AF THRU US1MF
Surface Mount Ultrafast Recovery Rectifier
Reverse Voltage – 50 to 1000 V Forward Current – 1 A
Features • Glass Passivated Chip Juntion • For surface mount applications • Low profil.
* Glass Passivated Chip Juntion * For surface mount applications * Low profile package * Easy to pick and place * High efficiency SMAF 4.4 4.9 3.3 3.7 2.40 2.80 1.3 1.6 Mechanical Data * Case: SMAF * Terminals: Solderable per MIL-STD-750, method 2026 0.12 0.2 0.9 1.1 Maximum Ratings and Electr. |
| Seller | Inventory | Price Breaks | Buy |
|---|---|---|---|
| Avnet | 140355 | 9000+ : 0.11549 USD 18000+ : 0.1131 USD 36000+ : 0.11081 USD 72000+ : 0.1079 USD |
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| Avnet | 0 | 7143+ : 0.09859 USD 14286+ : 0.09655 USD 28572+ : 0.0946 USD 57144+ : 0.09264 USD |
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| Newark | 1103 | 5+ : 0.578 USD 10+ : 0.392 USD 25+ : 0.359 USD 50+ : 0.326 USD |
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