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K5L2731CAM-D770 Preliminary MCP MEMORY MCP Specification 128Mb NOR Flash + 32Mb UtRAM INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSU

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A3R12E30CBF A3R12E40CBF 512Mb DDRII Synchronous DRAM 512Mb DDRII SDRAM Specification A3R12E30CBF A3R12E40CBF Zentel Electronics Corp. Revision 1.2

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SPECIFICATION Device Name : IGBT MODULE Type Name : 2MBI150U4B-120 Spec. No. : MS5F 6059 Mar. 09 ’05 S.Miyashita Mar. 09 ’05 T.Miyasaka K.Yamada

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GS8662QT07/10/19/37BD-357/333/300/250/200 165-Bump BGA Commercial Temp Industrial Temp 72Mb SigmaQuad-II+TM Burst of 2 SRAM 357 MHz–200 MHz 1.8 V V

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IGBT Module series for AT-NPC 3-level 12-in-1 Features Significant Low Power Loss and Size Reduction of Equipment Integrates 3-phase of AT-NPC 3-level

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GS8662S08/09/18/36BD-400/350/333/300/250 165-Bump BGA Commercial Temp Industrial Temp 72Mb SigmaSIOTM DDR -II Burst of 2 SRAM 400 MHz–250 MHz 1.8 V

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IS61QDPB24M18C/C1/C2 IS61QDPB22M36C/C1/C2 4Mx18, 2Mx36 72Mb QUADP (Burst 2) Synchronous SRAM (2.5 CYCLE READ LATENCY) APRIL 2018 FEATURES  2Mx36 an

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Preliminary GS8662Q08/09/18/36E-300/250/200/167 www.DataSheet4U.com 165-Bump BGA Commercial Temp Industrial Temp Features • Simultaneous Read and Writ

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IS66/67WVE2M16EALL/EBLL/ECLL IS66/67WVE2M16TALL/TBLL/TCLL 32Mb Async/Page PSRAM SEPTEMBER 2022 Overview The IS66/67WVE2M16EALL/BLL/CLL and IS66/67W

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Ceramic Disc Capacitors (Safety Regulations) Ceramic Disc Capacitors (Safety Regulations) Type NS-A IEC60384-14 Sub-class Y1/X1 Type TS IEC60384-14

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SPECIFICATION Device Name Type Name : IGBT MODULE (RoHS compliant product) : 2MBI200U4B-120-50 Spec. No. : MS5F6577 May. 11 ’06 K.Muramatsu May. 1

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165-Bump BGA Commercial Temp Industrial Temp GS8662DT20/38BD-550/500/450/400/350 GS8662DT06/11BD-500/450/400/350 72Mb SigmaQuad-II+TM Burst of 4 SRA

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GS8662DT07/10/19/37BD-450/400/350/333/300 165-Bump BGA Commercial Temp Industrial Temp 72Mb SigmaQuad-II+TM Burst of 4 SRAM 450 MHz–300 MHz 1.8 V V

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HY5RS123235BFP 512Mbit (16Mx32) GDDR3 SDRAM HY5RS123235BFP This document is a general product description and is subject to change without notice. Hy

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GS864018/32/36T-300/250/200/167 100-Pin TQFP Commercial Temp Industrial Temp 4M x 18, 2M x 32, 2M x 36 72Mb Sync Burst SRAMs 300 MHz–167 MHz 2.5 V

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GS8640FZ18/36T-xxxV 100-Pin TQFP Commercial Temp Industrial Temp 72Mb Flow Through Synchronous NBT SRAM 6.5 ns–8.0 ns 1.8 V or 2.5 V VDD 1.8 V or 2

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www.DataSheet4U.com Preliminary GS864018/32/36T-xxxV 100-Pin TQFP Commercial Temp Industrial Temp Features 4M x 18, 2M x 32, 2M x 36 72Mb Sync Burs

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6 IGBT V 6th Gen. IGBT Module V-series A compact design allows for greater power output · High performance 6th gen. IGBT/FWD chipset · Tj(max.)=17

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