.
NIC COMPONENTS
NPMH0806CMR24TR390F - Surface Mount Power Inductor
Surface Mount Power Inductor FEATURES • SIZES 0603, 0805, 0806, 1008 & 1210 SIZES • HIGH CURRENT AND LOW DCR CHARACTERISTICS • REFLOW SOLDERABLE • PA.
Toshiba Semiconductor
TMP86CM23AUG - 8-Bit Microcontroller
8 Bit Microcontroller TLCS-870/C Series TMP86CM23AUG The information contained herein is subject to change without notice. 021023_D TOSHIBA is contin.
Renesas
BCR16CM-12LB - Triac
BCR16CM-12LB 600V - 16A - Triac Medium Power Use Preliminary Datasheet R07DS1032EJ0400 (Previous: REJ03G0457-0300) Rev.4.00 Feb 25, 2013 Features .
NIC COMPONENTS
NPM0806CM1R5TR160F - Surface Mount Power Inductor
Surface Mount Power Inductor FEATURES • SIZES 0806, 1008 & 1210 SIZES • HIGH CURRENT AND LOW DCR CHARACTERISTICS • REFLOW SOLDERABLE • PACKAGE ON TAP.
Powerex Power Semiconductors
CR6CM - Lead-mount/ Phase Control SCR 6 Amperes/400-600 Volts
CR6CM Powerex, Inc., 200 Hillis Street, Youngwood, Pennsylvania 15697-1800 (412) 925-7272 Lead-mount, Phase Control SCR 6 Amperes/400-600 Volts OUTL.
Mitsubishi Electric Semiconductor
BCR16CM - TRIAC
MITSUBISHI SEMICONDUCTOR 〈TRIAC〉 BCR16CM MEDIUM POWER USE NON-INSULATED TYPE, PLANAR PASSIVATION TYPE BCR16CM OUTLINE DRAWING 10.5 MAX Dimensions .
NIC COMPONENTS
NPMH0806CMR68TR270F - Surface Mount Power Inductor
Surface Mount Power Inductor FEATURES • SIZES 0603, 0805, 0806, 1008 & 1210 SIZES • HIGH CURRENT AND LOW DCR CHARACTERISTICS • REFLOW SOLDERABLE • PA.
Toshiba Semiconductor
TMP86CM29BUG - 8 Bit Microcontroller
www.DataSheet4U.com 8 Bit Microcontroller TLCS-870/C Series TMP86CM29BUG TMP86CM29BUG The information contained herein is subject to change withou.
Toshiba
MIG150Q6CMB1X - Silicon N Channel IGBT
MIG150Q6CMB1X TOSHIBA Intelligent Power Module Silicon N Channel IGBT MIG150Q6CMB1X (1200V/150A 6in1) High Power Switching Applications Motor Control.
Renesas
BCR16CM-12LA - Triac
BCR16CM-12LA Triac Medium Power Use Features • IT (RMS) : 16 A • VDRM : 600 V • IFGTI, IRGTI, IRGT III : 30 mA (20 mA)Note6 Outline REJ03G0298-0300 R.
Renesas
BCR16CM-12LC - Triac
BCR16CM-12LC 600V - 12A - Triac Medium Power Use Features • IT (RMS) : 16 A • VDRM : 600 V • IFGTI, IRGTI, IRGT III: 50 mA Data Sheet R07DS1031EJ0300.
NIC COMPONENTS
NPM0806CM2R2TR150F - Surface Mount Power Inductor
Surface Mount Power Inductor FEATURES • SIZES 0806, 1008 & 1210 SIZES • HIGH CURRENT AND LOW DCR CHARACTERISTICS • REFLOW SOLDERABLE • PACKAGE ON TAP.
NIC COMPONENTS
NPM0806CM1R0TR220F - Surface Mount Power Inductor
Surface Mount Power Inductor FEATURES • SIZES 0806, 1008 & 1210 SIZES • HIGH CURRENT AND LOW DCR CHARACTERISTICS • REFLOW SOLDERABLE • PACKAGE ON TAP.
NIC COMPONENTS
NPM0806CMR68TR250F - Surface Mount Power Inductor
Surface Mount Power Inductor FEATURES • SIZES 0806, 1008 & 1210 SIZES • HIGH CURRENT AND LOW DCR CHARACTERISTICS • REFLOW SOLDERABLE • PACKAGE ON TAP.
NIC COMPONENTS
NPM0806CMR47TR290F - Surface Mount Power Inductor
Surface Mount Power Inductor FEATURES • SIZES 0806, 1008 & 1210 SIZES • HIGH CURRENT AND LOW DCR CHARACTERISTICS • REFLOW SOLDERABLE • PACKAGE ON TAP.
NIC COMPONENTS
NPM0806CMR24TR380F - Surface Mount Power Inductor
Surface Mount Power Inductor FEATURES • SIZES 0806, 1008 & 1210 SIZES • HIGH CURRENT AND LOW DCR CHARACTERISTICS • REFLOW SOLDERABLE • PACKAGE ON TAP.
NIC COMPONENTS
NPM0806CM2R2TR130F - Surface Mount Power Inductor
Surface Mount Power Inductor FEATURES • SIZES 0806, 1008 & 1210 SIZES • HIGH CURRENT AND LOW DCR CHARACTERISTICS • REFLOW SOLDERABLE • PACKAGE ON TAP.
NIC COMPONENTS
NPM0806CM1R0TR200F - Surface Mount Power Inductor
Surface Mount Power Inductor FEATURES • SIZES 0806, 1008 & 1210 SIZES • HIGH CURRENT AND LOW DCR CHARACTERISTICS • REFLOW SOLDERABLE • PACKAGE ON TAP.
NIC COMPONENTS
NPM0806CMR68TR240F - Surface Mount Power Inductor
Surface Mount Power Inductor FEATURES • SIZES 0806, 1008 & 1210 SIZES • HIGH CURRENT AND LOW DCR CHARACTERISTICS • REFLOW SOLDERABLE • PACKAGE ON TAP.
NIC COMPONENTS
NPM0806CMR56TR280F - Surface Mount Power Inductor
Surface Mount Power Inductor FEATURES • SIZES 0806, 1008 & 1210 SIZES • HIGH CURRENT AND LOW DCR CHARACTERISTICS • REFLOW SOLDERABLE • PACKAGE ON TAP.
