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National Semiconductor
NS16550A - UART Design and Application Considerations
www.DataSheet4U.com The NS16550A UART Design and Application Considerations The NS16550A UART Design and Application Considerations BACKGROUND UARTs.
ANADIGICS
AN-0003 - Thermal Considerations
Thermal Considerations for PAs AN-0003 Thermal Considerations for Power Amplifiers Overview Proper heatsinking to control junction temperature is an .
Silicon Laboratories
AN720 - OPTIMIZATION CONSIDERATIONS
AN720 P RECISION 32™ O P T I MI Z A T I O N C ONSIDERATIONS FOR C ODE S I Z E AND S PEED 1. Introduction The code size and execution speed of a 32-bit.
ANADIGICS
AN-0002 - Biasing Circuits and Considerations
MESFET Amplifier Biasing AN-0002 Biasing Circuits and Considerations for GaAs MESFET Power Amplifiers Summary In order to properly use any amplifier .
Fairchild Semiconductor
AN4105 - Design Considerations
www.DataSheet4U.com www.fairchildsemi.com Application Note AN4105 Design Considerations for Switched Mode Power Supplies Using A Fairchild Power Sw.
Freescale
AN2611 - System Considerations for Short Range RF Devices
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Philips
AN241 - Thermal Considerations
Philips Semiconductors Advanced BiCMOS Products Application note Thermal considerations for advanced logic families (Futurebus+, ABT and MULTIBYTE) .
Excelics
SOT-89 - PCB Mounting Considerations
SOT-89 PCB MOUNTING CONSIDERATIONS m o c.u 4te e h s ata d w . Hole diameter is limited by pcb thickness usually 2 x pcb thk. Hole density is limited.
