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Cs112 Matched Datasheet



Part Number Description Manufacture
HCS112MS
Radiation Hardened Dual JK Flip-Flop

• 3 Micron Radiation Hardened SOS CMOS
• Total Dose 200K RAD (Si)
• SEP Effective LET No Upsets: 100 MEV-cm2/mg
• Single Event Upset (SEU) Immunity 2 x 10-9 Errors/ Bit-Day (Typ)
• Dose Rate Survivability: 1 x 1012 RAD (Si)/s
• Dose Rate Upset
Manufacture
Intersil Corporation
ACS112MS
Radiation Hardened Dual J-K Flip-Flop

• Devices QML Qualified in Accordance with MIL-PRF-38535
• Detailed Electrical and Screening Requirements are Contained in SMD# 5962-96704 and Intersil’sIntersil QM Plan
• 1.25 Micron Radiation Hardened SOS CMOS
• Total Dose . . . . . . . . . . . . .
Manufacture
Intersil Corporation
CS1124
Dual Variable-Reluctance Sensor Interface IC
Dual Channel Capability Built
  –In Test Mode On
  –Chip Input Voltage Clamping Works from 5.0 V Supply Accurate Built
  –In Hysteresis VCC PIN CONNECTIONS AND MARKING DIAGRAM INAdj IN1 IN2 GND A WL, L YY, Y WW, W OUT1 To µP +
  – 1 1124 ALYW 8 VCC OUT1 OUT
Manufacture
ON Semiconductor
SCS112AG
SiC Schottky Barrier Diodes
1)Shorter recovery time 2)Reduced temperature dependence 3)High-speed switching possible
Construction Silicon carbide epitaxial planer type ROHM : TO-220AC
Absolute maximum ratings (Ta=25°C) Parameter Reverse voltage (repetitive) Reverse voltage
Manufacture
Rohm



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