GD-A-66 Datasheet | Specifications & PDF Download

MP6616 2A Single Phase BLDC Driver with Integrated Hall Sensor The Future of Analog IC Technology PRELIMINARY SPECIFICATIONS SUBJECT TO CHANGE DESCRI

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Features 30KP28(C)(A) THRU 30KP288(C)(A) 30000 Watts Transient Voltage Suppressors * 30000 Watts Peak Pulse Power Capability on 10/1000us waveform *

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Features 30KP28(C)(A) THRU 30KP288(C)(A) 30000 Watts Transient Voltage Suppressors * 30000 Watts Peak Pulse Power Capability on 10/1000us waveform *

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Technical Data Data Sheet N1056, Rev. A 66CNQ200 SCHOTTKY RECTIFIER 66CNQ200 Applications  Switching power supply  Converters  Free-Wheeling diod

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R www.jdsemi.cn ShenZhen Jingdao Electronic Co.,Ltd. 3866SF Bipolar Junction Transistor ◆Si NPN ◆RoHS COMPLIANT 1．APPLICATION Computer aided powe

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The Future of Analog IC Technology DESCRIPTION The MPQ2166 is an internally compensated, dual, PWM, synchronous, step-down regulator that operates fro

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Data Sheet ADA4661-2-KGD Known Good Die FEATURES 18 V, Precision, 725 µA, 4 MHz, CMOS RRIO Operational Amplifier GENERAL DESCRIPTION ► Low power at

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Features Datasheet RX66T Group R01DS0315EJ0110 Renesas MCUs 160-MHz, 32-bit RX MCU, on-chip FPU, 928 CoreMark, Supportive of 5V power supply, Rev

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Features * Standard Zener voltage tolerance is ± 20%. * Add suffix A for ± 10% tolerance and suffix B for ± 5% tolerance. * Other tolerances, non

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Features * Low power loss, high efficiency * Guard-ring for overvoltage protection * High surge current capability * Compliant to RoHS Directive 2011/

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Features * Low power loss, high efficiency * Guard-ring for overvoltage protection * High surge current capability * Compliant to RoHS Directive 2011/

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www.DataSheet4U.com MODULAR JACKS AND PLUGS KYCON Dimensions in In [mm] .811 [20.60] .050 [1.27] GDA Series GDA Series Dimensions C A .094 [2.40]

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SEMiX201GD066HDs SEMiX® 13 Trench IGBT Modules SEMiX201GD066HDs Features • Homogeneous Si • Trench = Trenchgate technology • VCE(sat) with positive t

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SKiM606GD066HD SKiM® 63 Trench IGBT Modules SKiM606GD066HD Features • IGBT 3 Trench Gate Technology • Solderless sinter technology • VCE(sat) with po

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GS8662QT07/10/19/37BD-357/333/300/250/200 165-Bump BGA Commercial Temp Industrial Temp 72Mb SigmaQuad-II+TM Burst of 2 SRAM 357 MHz–200 MHz 1.8 V V

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GS8662S08/09/18/36BD-400/350/333/300/250 165-Bump BGA Commercial Temp Industrial Temp 72Mb SigmaSIOTM DDR -II Burst of 2 SRAM 400 MHz–250 MHz 1.8 V

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Features Datasheet RX660 Group Renesas MCUs R01DS0393EJ0100 Rev.1.00 Mar 18, 2022 120-MHz 32-bit RX MCU, on-chip FPU, 709 CoreMark, Supportive of

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