SKiM606GD066HD

IGBT

Semikron International

* IGBT 3 Trench Gate Technology

* Solderless sinter technology

* VCE(sat) with positive temperature coefficient

* Low inductance case

* Insulated by Al2O3 DCB (Direct Copper Bonded) ceramic substrate

* Pressure contact technology for thermal contacts

SKiM606GD066HD

Semikron International

367.55 KB

Igbt.

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SKiM606GD066HD IGBT Semikron International

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