PA-Module Datasheet | Specifications & PDF Download

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Three Level NPC Q2Pack Module NXH400N100L4Q2F2SG, NXH400N100L4Q2F2PG The NXH400N100L4Q2 is a power module containing a I−type neutral point clamped th

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3W Ultra-compact Power Module HLK-PM01 230V AC to 5V/3W DC 220V AC to 5V DC, 600mA PCB Mounted Step-Down Power Supply Module Features  Meet UL, CE re

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SPECIFICATION SPEC. NO.： DATE： 11. 26.2014 PRODUCT NAME： REV： 1.2 AP6212 APPROVED CHECKED PREPARED DCC ISSUE NAME AMPAK Technology Inc. www.am

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CCB016M12GM3, CCB016M12GM3T 1200 V, 16 mΩ, Silicon Carbide, Six-Pack Module Technical Features • Ultra-Low Loss • High Frequency Operation • Zero Turn

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New Product LM8V302 Features s 20 cm [7.7 ] VGA format s Built-in CCFT backlight Color STN-LCD Module (Handheld PC) s Thin structure (8.0 mm) & lig

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CCB016M12GM3, CCB016M12GM3T 1200 V, 16 mΩ, Silicon Carbide, Six-Pack Module Technical Features • Ultra-Low Loss • High Frequency Operation • Zero Turn

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CCB021M12FM3, CCB021M12FM3T 1200 V, 21 mΩ, Silicon Carbide, Six-Pack Module Technical Features • Ultra-Low Loss • High Frequency Operation • Zero Turn

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ACX301AKM 5.1cm (2.0 Type) NTSC/PAL Color LCD Panel (Module with Backlight) Description The ACX301AKM is an LCD panel module with back light developed

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www.DataSheet4U.com Agilent HEDS-9710, HEDS-9711 200 lpi Analog Output Small Optical Encoder Modules Data Sheet Description The HEDS-9710/HEDS-9711

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www.DataSheet4U.com RPM973-H16 Photo Link Module Ultra-compact, Ultra-thin Top View FIR-compatible IrDA Module with Built-in Remote Control Transmis

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Global LCD Panel Exchange Center www.panelook.com DESCRIPTION The following specifications are applied to the following IPS-Pro-TFT LCD module. Pro

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KY-006 Passiv Piezo-Buzzer module KY-006 Passiv Piezo-Buzzer module Contents 1 Picture

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ADPA3D6P0816200W123W2 Datasheet Datasheet AAuuttoommoottiivvee--ggrraaddee AACC1EE2PP10AA20CC0VK0K, DV2D.,R5R35IV.I5VmEEmΩppΩotoywptwey.eprSr.miSCmoid

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® WON-TOP ELECTRONICS S30VT60 – S30VT160 35A GLASS PASSIVATED THREE-PHASE BRIDGE RECTIFIER MODULE Pb Features  Glass Passivated Die Construction 

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FEATURES: • First-In, First-Out memory module • 2K x 9 organization (IDT7M203S) • 4K x 9 ()rganization (IDT7M204S) • ,-ow-power consumption • Asynchro

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< Dual-In-Line Package Intelligent Power Module > PS219B3-S/-AS/-CS PS219B3-ST/-AST/-CST TRANSFER MOLDING TYPE INSULATED TYPE OUTLINE MAIN FUNCTION

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RFMD + TriQuint = Qorvo RF5410 LTE MMMB PA Module RF5410 is a multi-mode, multi-band (MMMB) linear Power Amplifier Module (PAM) designed for use as t

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HPM series | Features | • Extremely low leakage current • Extremely low ESR • High pulse power | Applications | • More than 100mA from milli-sec to s

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FPAL30SL60 FPAL30SL60 Smart Power Module (SPM) General Description FPAL30SL60 is an advanced smart power module (SPM) that Fairchild has newly develo

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