SOT23-6 (ZETEX)
Package information
Package information - SOT23-6
Surface mounted, 6 pin package Package outline
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LN2351 (Natlinear)
Super-Small Package VFM Control Step-up Switching Regulator
LN2351
Super-Small Package VFM Control Step-up Switching Regulator
■ General Description
The LN2351 Series is a CMOS VFM-control step-up switching re
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PS219A4-ASTX (Mitsubishi)
Dual-In-Line Package Intelligent Power Module
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CDLL4370A (Compensated Deuices Incorporated)
LEADLESS PACKAGE FOR SURFACE MOUNT
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BFT59 (Seme LAB)
Bipolar NPN Device in a Hermetically sealed TO18 Metal Package
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ME2149 (Microne)
ULTRA-SMALL PACKAGE PWM/PFM SWITCHING CONTROL STEP-UP SWITCHING REGULATOR
ME2149
ULTRA-SMALL PACKAGE PWM/PFM SWITCHING CONTROL STEP-UP SWITCHING REGULATOR
General Description
The ME2149 series is a CMOS step-up switching r
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CDLL4371A (Compensated Deuices Incorporated)
LEADLESS PACKAGE FOR SURFACE MOUNT
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ACT7006 (Aeroflex Circuit Technology)
ACT7005/7006 Single Package Solution Dual Transceiver/ Protocol/ Subsystem
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CDLL4372A (Compensated Deuices Incorporated)
LEADLESS PACKAGE FOR SURFACE MOUNT
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ESP32-PICO-D4 (Espressif)
System-in-Package
ESP32PICOD4
Datasheet
www.espressif.com
Version 2.0 Espressif Systems Copyright © 2022
About This Document
This document provides an introduction
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CSPRC032 (California Micro Devices Corp)
CHIP SCALE PACKAGE(CSP) EMI FILTER NETWORK
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PG-LQFP-64-6 (Infineon)
Package Outline
Additional Information, DS3, Nov. 2008
Recommendations for Printed Circuit Board Assembly of Infineon PG-LQFP-64-6, -8 -11/ PG-LQFP-100-2/PG-LQFP-100-
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PG-LQFP-64-12 (Infineon)
Package Outline
Additional Information, DS3, Nov. 2008
Recommendations for Printed Circuit Board Assembly of Infineon PG-LQFP-64-6, -8 -11/ PG-LQFP-100-2/PG-LQFP-100-
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OMD500 (Omnirel)
(OMD100 - OMD500) FOUR N-CHANNEL MOSFETS IN HERMETIC POWER PACKAGE
OMD100 OMD400 OMD200 OMD500
FOUR N-CHANNEL MOSFETS IN HERMETIC POWER PACKAGE
100V Thru 500V, Up To 25 Amp, N-Channel MOSFET In Hermetic Metal Package
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PESD5V0S2UAT (NXP)
Double ESD protection diodes in SOT23 package
DISCRETE SEMICONDUCTORS
DATA SHEET
PESDxS2UAT series Double ESD protection diodes in SOT23 package
Product specification 2004 Feb 18
Philips Semicon
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KTY10 (Siemens Semiconductor Group)
Silicon Spreading Resistance Temperature Sensor in Leaded Plastic Package
Silicon Spreading Resistance Temperature Sensor in Leaded Plastic Package
Features • Temperature dependent Resistor with Positive Temperature Coeffici
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CE8301 (Chipower)
Small Package PFM Control Step-Up DC/DC Converter
Small Package PFM Control Step-Up DC/DC Converter
CE8301 Series
Small Package PFM Control Step-Up DC/DC Converter
CE8301 Series
INTRODUCTION
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OM9551SP (ETC)
5V Input / 3A Output Current +3.3V / +2.5V +1.8V / +1.5V Output Switching Regulator Three Terminal Package
OM9551SP, OM9552SP, OM9553SP, OM9554SP
5V Input, 3A Output Current +3.3V, +2.5V +1.8V, +1.5V Output Switching Regulator Three Terminal Package
FEATU
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OM9552SP (ETC)
5V Input / 3A Output Current +3.3V / +2.5V +1.8V / +1.5V Output Switching Regulator Three Terminal Package
OM9551SP, OM9552SP, OM9553SP, OM9554SP
5V Input, 3A Output Current +3.3V, +2.5V +1.8V, +1.5V Output Switching Regulator Three Terminal Package
FEATU
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OVTL01LGARS (OPTEK Technologies)
1-Watt Cup Series Flush Mount and Surface Mount Packages
1-Watt Cup Series
Flush Mount and Surface Mount Packages
OVTL01LGA Series
www.datasheet4u.com
• • • • •
Robust energy-efficient design with long ope
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