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< DIPIPM > SLIMDIP-S TRANSFER MOLDING TYPE INSULATED TYPE OUTLINE MAIN FUNCTION AND RATINGS  RC-IGBT inverter bridge for three phase DC-to-AC power

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< DIPIPM > SLIMDIP-L TRANSFER MOLDING TYPE INSULATED TYPE OUTLINE MAIN FUNCTION AND RATINGS  RC-IGBT inverter bridge for three phase DC-to-AC power

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HK 19F SUBMINIATURE DIP RELAY Features ● 2 Form C configuration ● High switching capacity: 125VA/60W ● Bifurcated contacts ● Epoxy sealed for automat

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` HK 4100F/4101F SUBMINIATURE SIGNAL RELAY Features ● 3A switching capability ● 1 Form C ,B&Aconfiguration ● Standard PCB layout ● Plastic sealed an

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MITSUBISHI LINEAR ICs MS216 DUAL LARGE·CURRENT OPERATIONAL AMPLIFIERS (DUAL POWER SUPPLY TYPE) DESCRIPTION The M5216 is a semiconductor integrated ci

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DG3001/3002/3003 New Product Vishay Siliconix Low-Voltage Sub-Ohm SPST/SPDT MICRO FOOTr Analog Switch FEATURES D MICRO FOOT Chip Scale Package (1.0

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MITSUBISHI ELECTRIC Programmable Controllers Installation Manual for Base Units of the FX3U Series Art-no.: 169938 ENG, Version B, 17082007 Specifica

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< Silicon RF Power MOS FET (Discrete) > RD15HVF1 RoHS Compliance, Silicon MOSFET Power Transistor, 175MHz, 15W DESCRIPTION RD15HVF1 is a MOS FET type

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MITSUBISHI SEMICONDUCTOR 〈TRIAC〉 BCR8PM MEDIUM POWER USE INSULATED TYPE, PLANAR PASSIVATION TYPE BCR8PM OUTLINE DRAWING 10.5 MAX 5.2 Dimensions in

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HLMP-Pxxx Series, HLMP-Qxxx Series, HLMP-6xxx Series, HLMP-70xx Series Subminiature LED Lamps Data Sheet Description Flat Top Package The HLMP-Pxxx S

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8P2S-A EIAJ Package Code SOP8-P-225-1.27 JEDEC Code – Weight(g) 0.07 Lead Material Cu Alloy Plastic 8pin 225mil SOP e b2 8 5 HE E e1 Recommen

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JT105F-1 C US File No:E319069 File No:40038813 File No:13002100204 SUBMINIATURE HIGH POWER RELAY Features 40A switching capability 4kV directric stre

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