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SubCompact Board GENE-CV05 GENE-CV05 Intel Atom ® TM D2 550/N2800/N2600 Processor With LVDS 10/100/1000Base-TXEthernet 1 Mini Card, LPC 6 USB2.0,

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< DIPIPM > SLIMDIP-L TRANSFER MOLDING TYPE INSULATED TYPE OUTLINE MAIN FUNCTION AND RATINGS  RC-IGBT inverter bridge for three phase DC-to-AC power

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< DIPIPM > SLIMDIP-S TRANSFER MOLDING TYPE INSULATED TYPE OUTLINE MAIN FUNCTION AND RATINGS  RC-IGBT inverter bridge for three phase DC-to-AC power

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8P2S-A EIAJ Package Code SOP8-P-225-1.27 JEDEC Code – Weight(g) 0.07 Lead Material Cu Alloy Plastic 8pin 225mil SOP e b2 8 5 HE E e1 Recommen

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JQC-3FF SUBMINIATURE HIGH POWER RELAY General Purpose Power Relays JQC-3FF File No.:R50034671 File No.:E133481 File No.:CQC02001001953 Features *

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HK 23F SUBMINIATURE HIGH POWER RELAY Features ● Max.2A switching capability ● High sensitive: 150mW ● 1 Form C configutation ● Plastic sealed type av

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DA38 Series has a micro gap cut to an accuracy of several tens of microns in width for rapid response against induced lightning and electrostatic disc

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HK 19F SUBMINIATURE DIP RELAY Features ● 2 Form C configuration ● High switching capacity: 125VA/60W ● Bifurcated contacts ● Epoxy sealed for automat

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JT105F-1 C US File No:E319069 File No:40038813 File No:13002100204 SUBMINIATURE HIGH POWER RELAY Features 40A switching capability 4kV directric stre

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