TRB Datasheet | Specifications & PDF Download

Low ESR Tantalum Chip Capacitors FEATURES • Low ESR and High Ripple Current Ratings • Values from 10μF to 470μF • Suitable for Flow and Reflow Solderin

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GTRB266908FC Thermally-Enhanced High Power RF GaN on SiC HEMT 630 W, 48 V, 2515 – 2675 MHz Description The GTRB266908FC is a 630-watt (P4dB) GaN on Si

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Tantalum Chip Capacitors NTC-T Series FEATURES • MOLDED CONSTRUCTION FOR HIGH SOLDERING HEAT RESISTANCE • SEVEN CASE SIZES (P, A, B, C, V, D AND E

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Tantalum Chip Capacitors NTC-T Series FEATURES • MOLDED CONSTRUCTION FOR HIGH SOLDERING HEAT RESISTANCE • SEVEN CASE SIZES (P, A, B, C, V, D AND E

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Stacked Film Capacitor Chips FEATURES • STACKED METALLIZED POLYPHENYLENE SULFIDE (PPS) FILM • STANDARD EIA 0603, 0805, 1206, 1210, 1913 AND 2416 SIZES

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CYV15G0204TRB Independent Clock HOTLink II™ Dual Serializer and Dual Reclocking Deserializer Features ■ Second-generation HOTLink® technology ■ Compl

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BRIGHT LED ELECTRONICS CORP. Specification for Approval ● DEVICE NUMBER: BL-HKC36G-AV-TRB DATE PAGE 1 2 3 4 5 2016.02.26 1.0 1.0 1.0 1.0 1.0 67 1.

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GTRB204402FC/1 Thermally-Enhanced High Power RF GaN on SiC HEMT 350 W, 48 V, 1930 – 2020 MHz Description The GTRB204402FC/1 is a 350-watt (P3dB) GaN o

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Stacked Film Capacitor Chips FEATURES • STACKED METALLIZED ACRYLIC RESIN FILM (THERMO-CURE TYPE) • STANDARD EIA 0805, 1206 AND 1210 SIZES • HIGH HEAT

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Tantalum Chip Capacitors NTC-T Series FEATURES • MOLDED CONSTRUCTION FOR HIGH SOLDERING HEAT RESISTANCE • SEVEN CASE SIZES (P, A, B, C, V, D AND E

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BRIGHT LED ELECTRONICS CORP. SINCE 1981 DATA SHEET ● DEVICE NUMBER：BL-HB336G-TRB SHEET DATE 1 2 3 4 5 6 7 2004.09.17 2.0 2.0 2.0 2.0 2.0 2.

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Stacked Film Capacitor Chips NSWC Series FEATURES NSWC IS • STACKED METALLIZED POLYETHYLENE NAPHTHALATE (PEN) FILM RECOMMENDED • STANDARD EIA 1206,

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Stacked Film Capacitor Chips NSWC Series FEATURES NSWC IS • STACKED METALLIZED POLYETHYLENE NAPHTHALATE (PEN) FILM RECOMMENDED • STANDARD EIA 1206,

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Stacked Film Capacitor Chips FEATURES • STACKED METALLIZED ACRYLIC RESIN FILM (THERMO-CURE TYPE) • STANDARD EIA 0805, 1206 AND 1210 SIZES • HIGH HEAT

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Stacked Film Capacitor Chips FEATURES • STACKED METALLIZED POLYPHENYLENE SULFIDE (PPS) FILM • STANDARD EIA 0603, 0805, 1206, 1210, 1913 AND 2416 SIZES

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