VTB Datasheet | Specifications & PDF Download

W25N02KVxxIR/U 3V 2G-BIT SLC QSPINAND FLASH MEMORY WITH DUAL/QUAD SPI BUFFER READ & SEQUENTIAL READ Publication Release Date: June 25, 2021 Revision G

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W25N01GVxxIG/IT 3V 1G-BIT SERIAL SLC NAND FLASH MEMORY WITH DUAL/QUAD SPI BUFFER READ & CONTINUOUS READ Publication Release Date: May 09, 2018 Revisio

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VTB Process Photodiodes VTB1012, 1013 PACKAGE DIMENSIONS inch (mm) PRODUCT DESCRIPTION Small area planar silicon photodiode in a “flat” window, dua

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W25N01GVxxIG/IT 3V 1G-BIT SERIAL SLC NAND FLASH MEMORY WITH DUAL/QUAD SPI BUFFER READ & CONTINUOUS READ Publication Release Date: May 09, 2018 Revisio

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VTB Process Photodiodes VTB8440B, 8441B PACKAGE DIMENSIONS inch (mm) CASE 21F 8 mm CERAMIC CHIP ACTIVE AREA: .008 in2 (5.16 mm2) PRODUCT DESCRIPTI

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VTB Process Photodiodes VTB9412, 9413 PACKAGE DIMENSIONS inch (mm) CASE 20 6 mm CERAMIC CHIP ACTIVE AREA: .0025 in2 (1.60 mm2) ABSOLUTE MAXIMUM RA

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VTB Process Photodiodes VTB9412B, 9413B PACKAGE DIMENSIONS inch (mm) CASE 20F 6 mm CERAMIC CHIP ACTIVE AREA: .0025 in2 (1.60 mm2) PRODUCT DESCRIPT

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W25Q32FV 3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI Publication Release Date: June 03, 2016 Revision J W25Q32FV Table of Contents 1. GEN

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W25Q16CV 3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI www.DataSheet.net/ -1- Publication Release Date: April 01, 2011 Revision C Datasheet

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W25Q16DV 3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI Publication Release Date: May 23, 2016 -1- Revision K W25Q16DV Table of Contents 1.

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W25Q01JV-DTR 3.0V 1G-BIT (DUAL DIE) SERIAL FLASH MEMORY WITH DUAL/QUAD SPI, QPI & DTR Publication Release Date: November 13. 2019 -Revision B1 W25Q01

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W25N02KVxxIR/U 3V 2G-BIT SLC QSPINAND FLASH MEMORY WITH DUAL/QUAD SPI BUFFER READ & SEQUENTIAL READ Publication Release Date: June 25, 2021 Revision G

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VTB Process Photodiodes VTB1012B, 1013B PACKAGE DIMENSIONS inch (mm) CASE 17 TO-46 HERMETIC CHIP ACTIVE AREA: .0025 in2 (1.60 mm2) PRODUCT DESCRIP

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VTB Process Photodiodes VTB5051B PACKAGE DIMENSIONS inch (mm) CASE 14 TO-5 HERMETIC CHIP ACTIVE AREA: .023 in2 (14.8 mm2) PRODUCT DESCRIPTION Plan

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VTB Process Photodiodes VTB8341 PACKAGE DIMENSIONS inch (mm) PRODUCT DESCRIPTION Planar silicon photodiode mounted on a two lead ceramic substrate

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VTB Process Photodiodes VTB8440, 8441 PACKAGE DIMENSIONS inch (mm) CASE 21 8 mm CERAMIC CHIP ACTIVE AREA: .008 in2 (5.16 mm2) PRODUCT DESCRIPTION

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VTB Process Photodiodes VTB8440B, 8441B PACKAGE DIMENSIONS inch (mm) CASE 21F 8 mm CERAMIC CHIP ACTIVE AREA: .008 in2 (5.16 mm2) PRODUCT DESCRIPTI

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VTB Process Photodiodes VTB8440, 8441 PACKAGE DIMENSIONS inch (mm) CASE 21 8 mm CERAMIC CHIP ACTIVE AREA: .008 in2 (5.16 mm2) PRODUCT DESCRIPTION

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VTB Process Photodiodes VTB9412, 9413 PACKAGE DIMENSIONS inch (mm) CASE 20 6 mm CERAMIC CHIP ACTIVE AREA: .0025 in2 (1.60 mm2) ABSOLUTE MAXIMUM RA

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VTBT5UF201 RF Data Sheet FEATURES • Receiving Standard: USA • Receiving Channels: – VHF Section – Low Band – Air: 2 to 6 CATV: (A-8) A-5 to B – High B

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