* 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS 6 3.1 Pad Configuration WSON 8x6-mm 6 3.2 Pad Description WSON 8x6-mm 6 3.3 Pin Configuration SOIC 300-mil 7 3.4 Pin Description SOIC 300-mil 7 3.5 Ball Configuration TFBGA 8x6-mm (5x5 Ball Array) 8 3.6 Ball Description TFBGA 8x6-mm 8 4. PIN
W25Q01JVTBIM Datasheet (2.24 MB)
W25Q01JVTBIM
Winbond
2.24 MB
3.0v 1g-bit serial flash memory.
W25Q01JV-DTR
3.0V 1G-BIT (DUAL DIE) SERIAL FLASH MEMORY WITH DUAL/QUAD SPI, QPI & DTR
Publication Release Date: November 13. 2019 -Revision B1
W25Q01.
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