W25Q01JVSFIM

3.0V 1G-BIT SERIAL FLASH MEMORY

Winbond

W25Q01JVSFIM Features

* 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS 6 3.1 Pad Configuration WSON 8x6-mm 6 3.2 Pad Description WSON 8x6-mm 6 3.3 Pin Configuration SOIC 300-mil 7 3.4 Pin Description SOIC 300-mil 7 3.5 Ball Configuration TFBGA 8x6-mm (5x5 Ball Array) 8 3.6 Ball Description TFBGA 8x6-mm 8 4. PIN

W25Q01JVSFIM Datasheet (2.24 MB)

W25Q01JVSFIM Datasheet Preview — Preview of W25Q01JVSFIM PDF

Datasheet Details

Part number:

W25Q01JVSFIM

Manufacturer:

Winbond

File Size:

2.24 MB

Description:

3.0v 1g-bit serial flash memory.
W25Q01JV-DTR 3.0V 1G-BIT (DUAL DIE) SERIAL FLASH MEMORY WITH DUAL/QUAD SPI, QPI & DTR Publication Release Date: November 13. 2019 -Revision B1 W25Q01.

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W25Q01JVSFIM 3.0V 1G-BIT SERIAL FLASH MEMORY Winbond

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W25Q01JVSFIM Features

Datasheet Details

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Description:

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