AMIS-720639: 600dpi CIS Sensor Chip
AMI Semiconductor’s AMIS-720639 (PI3039) contact image sensor (CIS) sensor chip is a linear array image sensor chip with a 600
elements per inch resolution. The sensor chip is fabricated with AMI Semiconductor’s proprietary CMOS image sensing technology.
Since this image sensor chip is intended for CIS module applications, multiple numbers of these sensors will be serially cascaded to
form a linear scanning image array of arbitrary length. These sensors are butted end-to-end on a printed circuit board (PCB). The
sensors are mounted using the chip-on-board technology to form scanning arrays with various lengths.
Figure 1: AMIS-720639 Sensor Block Diagram
Figure 1 is a block diagram of the sensor chip. Each sensor chip consists of 192 detector elements, their associated multiplexing
switches, buffer amplifiers and a chip selector. The detector's element-to-element spacing is approximately 42µm. The size of each
chip without the scribe lines is 8080µm by 360µm and each sensor chip has six bonding pads. The pad symbols and functions are
described in Table 1.
Table 1: Pad Symbols and Functions
Start pulse: input to start the line scan
CP Clock pulse: input to clock the shift register
Positive supply: +5V supply connected to substrate
VSS is tied to ground: connection topside common
Video signal current output from a source follower
End-of-scan pulse: output from the shift register at end-of-scan
AMI Semiconductor – May 06, M-20569-001