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CP704. For precise diagrams, and layout, please refer to the original PDF.
Small Signal Transistors PROCESS CP704 PNP - High Current Transistor Chip www.DataSheet4U.com PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter...
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S DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAFER 23,450 PRINCIPAL DEVICE TYPES MPSA55 MPSA56 EPITAXIAL PLANAR 22 x 22 MILS 9.0 MILS 3.7 X 3.7 MILS 4.2 X 4.2 MILS Al - 30,000Å Au - 18,000Å BACKSIDE COLLECTOR 145 Adams Avenue Hauppauge, NY 11788 USA Tel: (631) 435-1110 Fax: (631) 435-1824 www.centralsemi.com R2 (23 -August 2006) Typical Electrical Characteristics PROCESS CP704 145 Adams Avenue Hauppauge, NY 11788 USA Tel: (631) 435-1110 Fax: (631) 435-1824 www.centralsemi.
CP704 Datasheet
