DB3TG Datasheet (PDF) Download
Fairchild Semiconductor
DB3TG

Key Features

  • VBO : 32V Version
  • Low break-over current
  • DO-35 package (JEDEC)
  • Hermetically sealed glass
  • pression bonded construction
  • All external surfaces are corrosion resistant and terminals are readily solderable
  • High reliability glass passivation insuring parameter stability and protection against junction contamination
  • Terminal: Pure tin plated, lead free, solderable per MIL-STD-202, Method 208 guaranteed
  • High temperature soldering guaranteed : 260°C/10 seconds September 2010 DO-35 Color Band Denotes Cathode