LP6836 phemt equivalent, medium power phemt.
* 25 dBm Output Power at 1-dB Compression at 18 GHz
* 9.5 dB Power Gain at 18 GHz
* 55% Power-Added Efficiency
DRAIN BOND PAD SOURCE BOND PAD (2x)
LP6836
GA.
DIE SIZE: 14.2X13.0 mils (360x330 µm) DIE THICKNESS: 3.9 mils (100 µm) BONDING PADS: 1.9X1.9 mils (50x50 µm)
The LP683.
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