re tr t d(off) tf Fig 10b. Switching Time Waveforms 1 Thermal Response (Z thJC ) D = 0.50 0.20 0.10 0.05 0.02 0.01 SINGLE PULSE (THERMAL RESPONSE) PDM t1 t2 Notes.

The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest powe.

Advanced HEXFET® Power MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely low onresistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET p.

IRL2203N

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IRL2203NPBF

IRL2203NS

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IRL2203S

IRL2310

IRL2505

IRL2505L

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