Download MB84VD2208xEA Datasheet PDF
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MB84VD2208xEA Key Features

  • Power supply voltage of 2.7 to 3.3V
  • High performance 90 ns maximum access time (Flash) 85 ns maximum access time (SRAM)
  • Operating Temperature -25 to +85°C
  • Package 73-ball FBGA
  • Simultaneous Read/Write operations (dual bank) Multiple devices available with different bank sizes Host system can prog
  • Minimum 100,000 write/erase cycles
  • Sector erase architecture Eight 4 K words and sixty three 32 K words. Any bination of sectors can be concurrently erased
  • Boot Code Sector Architecture MB84VD2208XEA: Top sector MB84VD2209XEA: Bottom sector
  • Embedded EraseTM Algorithms Automatically pre-programs and erases the chip or any sector
  • Embedded ProgramTM Algorithms Automatically writes and verifies data at specified address

MB84VD2208xEA Description

( DataSheet : .. ) FUJITSU SEMICONDUCTOR DATA SHEET DS05-50205-1E Stacked MCP (Multi-Chip Package) FLASH MEMORY & SRAM CMOS 32M (× 8/×16) FLASH MEMORY & 2M (× 8/×16) STATIC RAM MB84VD2208XEA-90/MB84VD2209XEA-90.