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GS8161E18(T/D)/GS816132(D)/GS816136(T/D)
100-Pin TQFP & 165-Bump BGA Commercial Temp Industrial Temp Features
• FT pin for user-configurable flow through or pipeline operation • Dual Cycle Deselect (DCD) operation • IEEE 1149.1 JTAG-compatible Boundary Scan • 2.5 V or 3.3 V +10%/–10% core power supply • 2.5 V or 3.3 V I/O supply • LBO pin for Linear or Interleaved Burst mode • Internal input resistors on mode pins allow floating mode pins • Default to Interleaved Pipeline mode • Byte Write (BW) and/or Global Write (GW) operation • Internal self-timed write cycle • Automatic power-down for portable applications • JEDEC-standard 100-lead TQFP and 165-bump BGA packages
1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs
250 MHz–133 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.
GS8161E18 Datasheet
