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GSI Technology

GS81313LT18GK Datasheet Preview

GS81313LT18GK Datasheet

144Mb SigmaDDR-IIIe Burst of 2 ECCRAM

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GS81313LT18/36GK-833/714/625
260-Pin BGA
Com & Ind Temp
HSTL I/O
144Mb SigmaDDR-IIIe™
Burst of 2 ECCRAM™
Up to 833 MHz
1.25V ~ 1.3V VDD
1.2V ~ 1.3V VDDQ
Features
• 4Mb x 36 and 8Mb x 18 organizations available
• 833 MHz maximum operating frequency
• 833 MT/s peak transaction rate (in millions per second)
• 60 Gb/s peak data bandwidth (in x36 devices)
• Common I/O DDR Data Bus
• Non-multiplexed SDR Address Bus
• One operation - Read or Write - per clock cycle
• Burst of 2 Read and Write operations
• 3 cycle Read Latency
• On-chip ECC with virtually zero SER
• 1.25V ~ 1.3V core voltage
• 1.2V ~ 1.3V HSTL I/O interface
• Configurable ODT (on-die termination)
• ZQ pin for programmable driver impedance
• ZT pin for programmable ODT impedance
• IEEE 1149.1 JTAG-compliant Boundary Scan
• 260-pin, 14 mm x 22 mm, 1 mm ball pitch, 6/6 RoHS-
compliant BGA package
SigmaDDR-IIIeFamily Overview
SigmaDDR-IIIe ECCRAMs are the Common I/O half of the
SigmaQuad-IIIe/SigmaDDR-IIIe family of high performance
ECCRAMs. Although very similar to GSI's second generation
of networking SRAMs (the SigmaQuad-II/SigmaDDR-II
family), these third generation devices offer several new
features that help enable significantly higher performance.
Clocking and Addressing Schemes
The GS81313LT18/36GK SigmaDDR-IIIe ECCRAMs are
synchronous devices. They employ three pairs of positive and
negative input clocks; one pair of master clocks, CK and CK,
and two pairs of write data clocks, KD[1:0] and KD[1:0]. All
six input clocks are single-ended; that is, each is received by a
dedicated input buffer.
CK and CK are used to latch address and control inputs, and to
control all output timing. KD[1:0] and KD[1:0] are used solely
to latch data inputs.
Each internal read and write operation in a SigmaDDR-IIIe B2
ECCRAM is two times wider than the device I/O bus. An input
data bus de-multiplexer is used to accumulate incoming data
before it is simultaneously written to the memory array. An
output data multiplexer is used to capture the data produced
from a single memory array read and then route it to the
appropriate output drivers as needed. Therefore, the address
field of a SigmaDDR-IIIe B2 ECCRAM is always one address
pin less than the advertised index depth (e.g. the 8M x 18 has
4M addressable index).
On-Chip Error Correction Code
GSI's ECCRAMs implement an ECC algorithm that detects
and corrects all single-bit memory errors, including those
induced by SER events such as cosmic rays, alpha particles,
etc. The resulting Soft Error Rate of these devices is
anticipated to be <0.002 FITs/Mb — a 5-order-of-magnitude
improvement over comparable SRAMs with no on-chip ECC,
which typically have an SER of 200 FITs/Mb or more.
All quoted SER values are at sea level in New York City.
Speed Grade
-833
-714
-625
Parameter Synopsis
Max Operating Frequency
833 MHz
714 MHz
625 MHz
Read Latency
3 cycles
3 cycles
3 cycles
VDD
1.2V to 1.35V
1.2V to 1.35V
1.2V to 1.35V
Rev: 1.13 7/2016
1/29
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2014, GSI Technology




GSI Technology

GS81313LT18GK Datasheet Preview

GS81313LT18GK Datasheet

144Mb SigmaDDR-IIIe Burst of 2 ECCRAM

No Preview Available !

GS81313LT18/36GK-833/714/625
8M x 18 Pinout (Top View)
1 2 3 4 5 6 7 8 9 10 11 12 13
A
VDD
VDDQ
VDD
VDDQ
NC
(RSVD)
MCH
(CFG)
MCL
ZQ
PZT1 VDDQ VDD VDDQ VDD
B
VSS NUIO VSS
NUI
MCL
MCL
NC
(RSVD)
MCL
(SIOM)
PZT0
NUI
VSS DQ0 VSS
C DQ17 VDDQ NUI VDDQ VSS SA VDD SA VSS VDDQ NUI VDDQ NUIO
D
VSS NUIO VSS
NUI
SA
VDDQ
NC
(288 Mb)
VDDQ
SA
NUI VSS DQ1 VSS
E DQ16 VDDQ NUI VDD VSS SA VSS SA VSS VDD NUI VDDQ NUIO
F VSS NUIO VSS NUI SA VDD VDDQ VDD SA NUI VSS DQ2 VSS
G DQ15 NUIO NUI NUI VSS SA MZT1 SA VSS NUI NUI DQ3 NUIO
H DQ14 VDDQ NUI VDDQ SA VDDQ R/W VDDQ SA VDDQ NUI VDDQ NUIO
J VSS NUIO VSS NUI VSS SA VSS SA VSS NUI VSS DQ4 VSS
K CQ1 VDDQ VREF VDD KD1 VDD CK VDD KD0 VDD VREF VDDQ CQ0
L CQ1 VSS QVLD1 VSS KD1 VDDQ CK VDDQ KD0 VSS QVLD0 VSS CQ0
M VSS DQ13 VSS NUI VSS SA VSS SA VSS NUI VSS NUIO VSS
N NUIO VDDQ NUI VDDQ PLL VDDQ LD VDDQ MCH VDDQ NUI VDDQ DQ5
P NUIO DQ12 NUI NUI VSS SA MZT0 SA VSS NUI NUI NUIO DQ6
R VSS DQ11 VSS NUI MCH VDD VDDQ VDD RST NUI VSS NUIO VSS
T NUIO VDDQ NUI VDD VSS SA VSS SA VSS VDD NUI VDDQ DQ7
U
VSS DQ10 VSS
NUI
NC
(576 Mb)
VDDQ
NC
(RSVD)
VDDQ
NC
(1152 Mb)
NUI
VSS NUIO VSS
V
NUIO VDDQ NUI VDDQ VSS
SA
(x18)
VDD
SA
(B2)
VSS VDDQ NUI VDDQ DQ8
W VSS DQ9 VSS NUI TCK MCL RCS MCL TMS NUI VSS NUIO VSS
Y
VDD VDDQ VDD VDDQ TDO
ZT
NC
(RSVD)
MCL
TDI
VDDQ VDD VDDQ VDD
Notes:
1. Pins 5B, 6B, 6W, 7A, 8W, and 8Y must be tied Low in this device.
2. Pins 5R and 9N must be tied High in this device.
3. Pin 6A is defined as mode pin CFG in the pinout standard. It must be tied High in this device to select x18 configuration.
4. Pin 8B is defined as mode pin SIOM in the pinout standard. It must be tied Low in this device to select Common I/O configuration.
5. Pin 6V is defined as address pin SA for x18 devices. It is used in this device.
6. Pin 8V is defined as address pin SA for B2 devices. It is used in this device.
7. Pin 7D is reserved as address pin SA for 288Mb devices. It is a true no-connect in this device.
8. Pin 5U is reserved as address pin SA for 576 Mb devices. It is a true no connect in this device.
9. Pin 9U is reserved as address pin SA for 1152 Mb devices. It is a true no connect in this device.
Rev: 1.13 7/2016
2/29
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2014, GSI Technology


Part Number GS81313LT18GK
Description 144Mb SigmaDDR-IIIe Burst of 2 ECCRAM
Maker GSI Technology
Total Page 29 Pages
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