IXGR72N60B3H1 igbt equivalent, igbt.
Silicon Chip on Direct-Copper Bond (DCB) Substrate Isolated Mounting Surface Optimized for Low Conduction and Switching Losses 2500V~ Electrical Isolation Square RBSOA A.
Symbol Test Conditions (TJ = 25C, Unless Otherwise Specified) VGE(th) ICES IGES VCE(sat) IC = 250A, VCE = VGE TJ = 125.
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