IRFP260
Overview
- International standard package JEDEC TO-247 AD
- Low RDS (on) HDMOSTM process
- Rugged polysilicon gate cell structure
- High commutating dv/dt rating
- Fast switching times Maximum lead temperature for soldering 1.6 mm (0.062 in.) from case for 10 s ww w.D ata Sh eet 4U .co m Symbol Test Conditions Characteristic Values (TJ = 25°C, unless otherwise specified) min. typ. max. 200 2 4 ±100 TJ = 25°C TJ = 125°C 25 250 V V nA µA µA Ω
