* z Maximum Lead Temperature for Soldering 1.6mm (0.062 in.) from Case for 10s TO-263 TO-220 z z Optimized for Low Conduction and Switching Losses Square RBSOA International Standard Packages Advantages z z High Power Density Low Gate Drive Requirement Symbol Test Conditions (TJ = 25°C, Unless O
IXGP20N120B3 Datasheet (232.48 KB)
IXGP20N120B3
IXYS Corporation
232.48 KB
Genx3 1200v igbt.
Preliminary Technical Information GenX3TM 1200V IGBT IXGA20N120B3 IXGP20N120B3 VCES = 1200V IC90 = 20A VCE(sat) ≤ 3.1V High Speed Low Vsat PT IGBT.
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