SIGC16T120C Datasheet | Infineon

.. IGBT Chip in NPT-technology Features : - 1200V NPT technology - 200µm chip - short circuit prove - positive temperature coefficient - easy paralleling This chip is used for: - BUP 311D /BUP 212 Applications: - drives Chip Type VCE 1200V ICn 8A Die Size 4.04 x 4 mm2 Package sawn on foil Ordering Code Q67041-A4673A003 MECHANICAL PARAMETER: Raster size Area total / active Emitter pad size Gate pad size Thickness Wafer size Flat position Max.possible chips per wafer Passivation frontside Emitter metalization Collector metalization Die bond Wire bond Reject Ink Dot Size Remended Storage Environment 4.04 x 4 16.16 / 10.4 1.88x2.18...