SIGC185T170R2C Datasheet | Infineon

.. IGBT Chip in NPT-technology Features : - 1700V NPT technology - 280µm chip - short circuit prove - positive temperature coefficient - easy paralleling This chip is used for: - IGBT-Module BSM100GB170DL Applications: - drives Chip Type ICn Die Size 13.56 x 13.56 mm2 Package sawn on foil Ordering Code Q67041-A4697A001 1700V 100A MECHANICAL PARAMETER: Raster size Area total / active Emitter pad size Gate pad size Thickness Wafer size Flat position Max.possible chips per wafer Passivation frontside Emitter metalization Collector metalization Die bond Wire bond Reject Ink Dot Size Remended Storage Environment 13.56 x...