PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is .

The IRF6611 combines the latest HEXFET® power MOSFET silicon technology with advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of an SO-8 and only 0.7 mm profile. The DirectFET package is com.

IRF6610

IRF6611PbF

IRF6611TRPbF

IRF6612

IRF6612PbF

IRF6612TR1

IRF6613

IRF6613PBF

IRF6613TRPBF

IRF6614

IRF6614PBF

IRF6614TRPBF

IRF6616