PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is .

The IRF7759L2TR/TR1PbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has a footprint smaller than a D2PAK and only 0.7 mm profile. The D.

IRF7759L2TR1PBF

IRF7759L2TRPBF

IRF7750

IRF7750GPBF

IRF7750PbF

IRF7751

IRF7751GPBF

IRF7751PbF

IRF7752

IRF7752GPBF

IRF7754

IRF7754GPBF

IRF7755