HUF75309D3S
Features
- 19A, 55V
- Simulation Models
- Temperature pensated PSPICE® and SABER™ Models
- SPICE and SABER Thermal Impedance Models Available on the WEB at: .fairchildsemi.
- Peak Current vs Pulse Width Curve
- UIS Rating Curve
- Related Literature
- TB334, “Guidelines for Soldering Surface Mount ponents to PC Boards”
Symbol
Ordering Information
PART NUMBER HUF75309P3 HUF75309D3 HUF75309D3S PACKAGE TO-220AB TO-251AA TO-252AA BRAND 75309P 75309D 75309D
NOTE: When ordering, use the entire part number. Add the suffix T to obtain the TO-252AA variant in tape and reel, e.g., HUF75309D3ST.
Packaging
JEDEC STYLE TO-220AB
SOURCE DRAIN GATE DRAIN (FLANGE) DRAIN (FLANGE)
JEDEC TO-251AA
SOURCE DRAIN GATE
JEDEC TO-252AA
DRAIN (FLANGE)
GATE SOURCE
Product reliability information can be found at http://.fairchildsemi./products/discrete/reliability/index.html For severe environments, see our Automotive HUFA series. All Fairchild semiconductor products are manufactured, assembled and...
