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ICM-20948 Datasheet Preview

ICM-20948 Datasheet

Lowest Power 9-Axis MEMS MotionTracking Device

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ICM-20948
World’s Lowest Power 9-Axis MEMS MotionTracking™ Device
GENERAL DESCRIPTION
The ICM-20948 is the world’s lowest power 9-axis
MotionTracking device that is ideally suited for Smartphones,
Tablets, Wearable Sensors, and IoT applications.
3-axis gyroscope, 3-axis accelerometer, 3-axis
compass, and a Digital Motion Processor™ (DMPTM)
in a 3 mm x 3 mm x 1 mm (24-pin QFN) package
DMP offloads computation of motion processing
algorithms from the host processor, improving
system power performance
Software drivers are fully compliant with Google’s
latest Android release
EIS FSYNC support
ICM-20948 supports an auxiliary I2C interface to external
sensors, on-chip 16-bit ADCs, programmable digital filters, an
embedded temperature sensor, and programmable
interrupts. The device features an operating voltage range
down to 1.71V. Communication ports include I2C and high
speed SPI at 7 MHz.
Note: ICM-20948 VDDIO range is 1.71V to 1.95V, different
than the MPU-9250 9-axis device.
ORDERING INFORMATION
PART
TEMP RANGE PACKAGE
ICM-20948†
−40°C to +85°C
24-Pin QFN
Denotes RoHS and Green-Compliant Package
BLOCK DIAGRAM
APPLICATIONS
Smartphones and Tablets
Wearable Sensors
IoT Applications
FEATURES
Lowest Power 9-Axis Device at 2.5 mW
3-Axis Gyroscope with Programmable FSR of
±250 dps, ±500 dps, ±1000 dps, and ±2000 dps
3-Axis Accelerometer with Programmable FSR of
±2g, ±4g, ±8g, and ±16g
3-Axis Compass with a wide range to ±4900 µT
Onboard Digital Motion Processor (DMP)
Android support
Auxiliary I2C interface for external sensors
On-Chip 16-bit ADCs and Programmable Filters
7 MHz SPI or 400 kHz Fast Mode I²C
Digital-output temperature sensor
VDD operating range of 1.71V to 3.6V
MEMS structure hermetically sealed and bonded at
wafer level
RoHS and Green compliant
TYPICAL OPERATING CIRCUIT
nCS
SCLK
SDI
NC 1
NC 2
NC 3
NC 4
NC 5
NC 6
ICM-20948
18 GND
17 NC
16 NC
15 NC
14 NC
13 VDD
1.71 – 3.6VDC
C2, 0.1 µF
1.71 – 1.95VDC
C3, 0.1 µ F
SDO
C1, 0.1 µF
InvenSense reserves the right to change the detail
specifications as may be required to permit
improvements in the design of its products.
TDK Corporation
1745 Technology Drive, San Jose, CA 95110 U.S.A
+1(408) 988–7339
www.invensense.com
Document Number: DS-000189
Revision: 1.3
Release Date: 06/02/2017




InvenSense

ICM-20948 Datasheet Preview

ICM-20948 Datasheet

Lowest Power 9-Axis MEMS MotionTracking Device

No Preview Available !

ICM-20948
TABLE OF CONTENTS
GENERAL DESCRIPTION......................................................................................................................................................... 1
ORDERING INFORMATION ..................................................................................................................................................... 1
BLOCK DIAGRAM................................................................................................................................................................. 1
APPLICATIONS..................................................................................................................................................................... 1
FEATURES .......................................................................................................................................................................... 1
TYPICAL OPERATING CIRCUIT ................................................................................................................................................. 1
1 GENERAL DESCRIPTION........................................................................................................................................9
1.1 PURPOSE AND SCOPE ............................................................................................................................................... 9
1.2 PRODUCT OVERVIEW ............................................................................................................................................... 9
1.3 APPLICATIONS......................................................................................................................................................... 9
2 FEATURES ..........................................................................................................................................................10
2.1 GYROSCOPE FEATURES ........................................................................................................................................... 10
2.2 ACCELEROMETER FEATURES..................................................................................................................................... 10
2.3 MAGNETOMETER FEATURES .................................................................................................................................... 10
2.4 DMP FEATURES.................................................................................................................................................... 10
2.5 ADDITIONAL FEATURES ........................................................................................................................................... 10
3 ELECTRICAL CHARACTERISTICS...........................................................................................................................11
3.1 GYROSCOPE SPECIFICATIONS.................................................................................................................................... 11
3.2 ACCELEROMETER SPECIFICATIONS ............................................................................................................................. 12
3.3 MAGNETOMETER SPECIFICATIONS ............................................................................................................................ 13
3.4 ELECTRICAL SPECIFICATIONS..................................................................................................................................... 13
D.C. Electrical Characteristics ................................................................................................................................... 13
A.C. Electrical Characteristics ................................................................................................................................... 14
Other Electrical Specifications .................................................................................................................................. 15
3.5 I2C TIMING CHARACTERIZATION ............................................................................................................................... 16
3.6 SPI TIMING CHARACTERIZATION............................................................................................................................... 17
3.7 ABSOLUTE MAXIMUM RATINGS ............................................................................................................................... 18
4 APPLICATIONS INFORMATION ...........................................................................................................................19
4.1 PIN OUT DIAGRAM AND SIGNAL DESCRIPTION ............................................................................................................ 19
4.2 TYPICAL OPERATING CIRCUIT ................................................................................................................................... 20
4.3 BILL OF MATERIALS FOR EXTERNAL COMPONENTS ....................................................................................................... 20
4.4 EXPOSED DIE PAD PRECAUTIONS .............................................................................................................................. 20
4.5 BLOCK DIAGRAM................................................................................................................................................... 21
4.6 OVERVIEW ........................................................................................................................................................... 21
4.7 THREE-AXIS MEMS GYROSCOPE WITH 16-BIT ADCS AND SIGNAL CONDITIONING ............................................................ 22
4.8 THREE-AXIS MEMS ACCELEROMETER WITH 16-BIT ADCS AND SIGNAL CONDITIONING...................................................... 22
4.9 THREE-AXIS MEMS MAGNETOMETER WITH 16-BIT ADCS AND SIGNAL CONDITIONING ..................................................... 22
4.10 DIGITAL MOTION PROCESSOR.................................................................................................................................. 22
4.11 PRIMARY I2C AND SPI SERIAL COMMUNICATIONS INTERFACES ....................................................................................... 22
ICM-20948 Solution Using I2C Interface.................................................................................................................... 22
ICM-20948 Solution Using SPI Interface ................................................................................................................... 23
4.12 AUXILIARY I2C SERIAL INTERFACE.............................................................................................................................. 24
4.13 SELF-TEST ............................................................................................................................................................ 24
4.14 CLOCKING ............................................................................................................................................................ 25
4.15 SENSOR DATA REGISTERS........................................................................................................................................ 25
Document Number: DS-000189
Revision: 1.3
Page 2 of 89


Part Number ICM-20948
Description Lowest Power 9-Axis MEMS MotionTracking Device
Maker InvenSense
Total Page 30 Pages
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