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Maxim Integrated Semiconductor Electronic Components Datasheet

MAX11164 Datasheet

SAR ADC

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MAX11164
16-Bit, 500ksps, 0 to 5V SAR ADC with
Internal Reference in TDFN
General Description
The MAX11164 16-bit, 500ksps, SAR ADC offers excellent
AC and DC performance with unipolar input range, small
size, and internal reference. The MAX11164 integrates an
optional internal reference and buffer, saving additional
cost and space.
This ADC achieves 92.2dB SNR and -104dB THD. The device
guarantees 16-bit no-missing codes and ±0.5 LSB (typ).
The MAX11164 communicates using an SPI-compatible
serial interface at 2.5V, 3V, 3.3V, or 5V logic. The serial
interface can be used to daisy-chain multiple ADCs for
multichannel applications and provides a busy indicator
option for simplified system synchronization and timing.
The MAX11164 is offered in a 12-pin, 3mm x 3mm,
TDFN package and is specified over the -40NC to +85NC
temperature range.
Applications
● Data Acquisition Systems
● Industrial Control Systems/Process Control
● Medical Instrumentation
● Automatic Test Equipment
Benefits and Features
● High DC/AC Accuracy Improves Measurement
Quality
• 16-Bit Resolution with No Missing Codes
• 500ksps Throughput Rates Without Pipeline Delay/
Latency
• 92.2dB SNR and -104dB THD at 10kHz
• 0.5 LSBRMS Transition Noise
• ±0.2LSB DNL (typ) and ±0.5LSB INL (typ)
● Highly Integrated ADC Saves Cost and Space
• ±6ppm/°C Internal Reference
• Internal Reference Buffer
● Wide Supply Range and Low Power Simplify
Power-Supply Design
• 5V Analog Supply
• 2.3V to 5V Digital Supply
• 23.7mW Power Consumption at 500ksps
10μA in Shutdown Mode
● Multi-Industry Standard Serial Interface and Small
Package Reduces Size
• SPI/QSPI/MICROWIRE®/DSP-Compatible Serial
Interface
• 3mm x 3mm Tiny 12-Pin TDFN Package
Selector Guide and Ordering Information appear at end of
data sheet.
QSPI is a trademark of Motorola, Inc.
MICROWIRE is a registered trademark of National
Semiconductor Corporation.
Typical Operating Circuit
0 to +5V
1µF VDD
(5V)
1µF OVDD
(2.3V TO 5V)
10
MAX9632
4.7nF
C0G
Ceramic
AIN+
AIN-
REF
10µF
16-BIT ADC
MAX11164
INTERFACE
AND CONTROL
CONFIGURATION REGISTER
INTERNAL
REF REFERENCE
BUF
AGNDS
GND
SCLK
DIN
DOUT
CNVST
HOST
CONTROLLER
REFIO
0.1µF
14-Bit to 18-Bit SAR ADC Family
14-BIT
16-BIT
16-BIT 18-BIT
500KSPS 250KSPS 500KSPS 500KSPS
±5V Input
Internal
Reference
0 to 5V Input
Internal
Reference
MAX11167
MAX11169
MAX11161
MAX11165
0 to 5V Input
External
MAX11262 MAX11163
Reference
MAX11166 MAX11156
MAX11168 MAX11158
MAX11160 MAX11150
MAX11164 MAX11154
MAX11162 MAX11152
19-6723; Rev 2; 11/15


Maxim Integrated Semiconductor Electronic Components Datasheet

MAX11164 Datasheet

SAR ADC

No Preview Available !

MAX11164
16-Bit, 500ksps, 0 to 5V SAR ADC with
Internal Reference in TDFN
Absolute Maximum Ratings
VDD to GND.............................................................-0.3V to +6V
OVDD to GND........ -0.3V to the lower of (VDD + 0.3V) and +6V
AIN+ to GND............................................................-0.3V to +6V
AIN-, REF, REFIO, AGNDS
to GND................ -0.3V to the lower of (VDD + 0.3V) and +6V
SCLK, DIN, DOUT, CNVST
to GND................ -0.3V to the lower of (VDD + 0.3V) and +6V
Maximum Current into Any Pin...........................................50mA
Continuous Power Dissipation (TA = +70NC)
TDFN (derate 18.2mW/NC above +70NC)...................1349mW
Operating Temperature Range............................ -40NC to +85NC
Junction Temperature.......................................................+150NC
Storage Temperature Range............................. -65NC to +150NC
Lead Temperature (soldering, 10s).................................. +300NC
Soldering Temperature (reflow)........................................+260NC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
Package Thermal Characteristics (Note 1)
TDFN
Junction-to-Ambient Thermal Resistance (qJA).......59.3NC/W
Junction-to-Case Thermal Resistance (qJC)............22.5NC/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Electrical Characteristics
(VDD = 4.75V to 5.25V, VOVDD = 2.3V to 5.25V, fSAMPLE = 500ksps, Reference Mode 3, VREF = 4.096V; TA = TMIN to TMAX, unless
otherwise noted. Typical values are at TA = +25NC.) (Note 2)
PARAMETER
ANALOG INPUT (Note 3)
Input Voltage Range
SYMBOL
CONDITIONS
5.000
AIN+ to AIN-, K = 4.096
MIN TYP MAX UNITS
0
+K x
VREF
V
Absolute Input Voltage Range
Input Leakage Current
Input Capacitance
Input-Clamp Protection Current
STATIC PERFORMANCE (Note 4)
Resolution
No Missing Codes
Offset Error
N
AIN+ to GND
AIN- to GND
Acquisition phase
Both inputs
-0.1
+(VDD
+ 0.1)
-0.1 +0.1
-10 +0.001 +10
32
-20 +20
V
µA
pF
mA
16 Bits
16 Bits
-4.0 ±1 +4.0 mV
Offset Error Temperature
Coefficient
±0.006
LSB/°C
Gain Error
-3.9 ±1.4 +3.9 LSB
Gain Error Temperature
Coefficient
±0.008
LSB/°C
Integral Nonlinearity
Differential Nonlinearity
Positive Full-Scale Error
Analog Input CMRR
INL
DNL
Guaranteed by design
CMRR
-1.5 ±0.5 +1.5 LSB
-0.5 ±0.2 +0.5 LSB
-5.5
+5.5
LSB
-1.96
LSB/V
www.maximintegrated.com
Maxim Integrated 2


Part Number MAX11164
Description SAR ADC
Maker Maxim Integrated
Total Page 28 Pages
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