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Maxim Integrated Semiconductor Electronic Components Datasheet

MAX14983E Datasheet

Enhanced 1:2 VGA Mux

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MAX14983E
EVALUATION KIT AVAILABLE
Enhanced 1:2 VGA Mux with
Monitor Detection and Priority Port Logic
General Description
The MAX14983E integrates high-bandwidth analog switches,
level-translating buffers, and 5V power switches to
implement a complete 1:2 multiplexer for VGA monitors.
The device switches graphics signals between a control-
ler and two outputs. Integrated pullup resistors (2.2kΩ,
typ) are provided on the monitor-side display data channel
(DDC) signal lines.
The device features a simple power interface that
operates with a single +5V supply input. Two integrated
power switches with current limiting and reverse-current
protection pass the +5V supply to external loads with
minimal voltage drop.
The horizontal and vertical synchronization (HSYNC/
VSYNC) buffers shift logic levels to support +2.5V to
+5.0V CMOS or TTL-compatible graphics controllers
while meeting the VESA drive capability requirement of
±8mA. An internal 2.5V regulator translates the DDC
voltage levels to be compatible with low-voltage graphics
controllers.
The device also features monitor-detect outputs and
enable inputs that allow monitor switching to operate either
automatically or with inputs from the graphics controller.
The MAX14983E is available in a 32-pin (5mm x 5mm)
TQFN package, and is specified over the -40°C to +85°C
extended temperature range.
Applications
● Servers
● KVM Switches
● Computing
● Graphics Cards
Ordering Information appears at end of data sheet.
Benefits and Features
● Design Flexibility
• Graphics Controller Port is Protected when
VCC = 0V
• DDC Switches Limit Voltage to Low-Voltage Supply
• Internal +2.5V Regulator
● High Level of Integration for Enhanced Performance
• Low 5.5pF (typ) RGB Capacitance
• 2.0ns (typ) tR/tF with 10pF, 2.2kΩ Load on Monitor-
Side SYNC Signals
• Source and Sink 8mA While Meeting Speed
Requirements
• ±11kV Human Body Model (HBM)
● Saves Space on Board
• Internal Power Switches
• Pass +5V with 300mV (max) IR Drop
• Short-Circuit/Thermal/Reverse-Current
Protection
• 5mm x 5mm, 32-Pin TQFN Package
Typical Application Circuit
+2.5V
+5V
0.1µF
GRAPHICS
CONTROLLER
3
R0, G0, B0
VCC R1, G1, B1
2
HSYNC0, VSYNC0 HSYNC1, VSYNC1
2
SCL0, SDA0
SCL1, SDA1
+5V +5V
MDOR
MAX14983E
S5V1
R2, G2, B2
MD1 HSYNC2, VSYNC2
MD2 SCL2, SDA2
EN1 S5V2
EN2
3
2
2
VGA
PORT 1
1µF
3
2
2
VGA
PORT 2
1µF
REF
105
GND
19-5935; Rev 1; 9/17


Maxim Integrated Semiconductor Electronic Components Datasheet

MAX14983E Datasheet

Enhanced 1:2 VGA Mux

No Preview Available !

MAX14983E
Enhanced 1:2 VGA Mux with
Monitor Detection and Priority Port Logic
Absolute Maximum Ratings
(Voltages referenced to GND.)
VCC, S5V1, S5V2, SDA_, SCL_, REF, MD_,
EN_, MDOR..........................................................-0.3V to +6V
HSYNC_, VSYNC_, R_, G_, B_............... -0.3V to (VCC + 0.3V)
Continuous Current Through R_, G_, B_ Switches..........±50mA
Continuous Current Through SDA_, SCL_ Switches........±50mA
Continuous Current Through S5V_.................................±750mA
Peak Current Through R_, G_, B_, SDA_, SCL_
(10% duty cycle)........................................................ ±100mA
Continuous Power Dissipation (TA = +70°C)
TQFN (derate 34.5mW/°C above +70°C)...............2758.6mW
Operating Temperature Range............................ -40°C to +85°C
Junction Temperature.......................................................+150°C
Storage Temperature Range............................. -65°C to +150°C
Lead Temperature (soldering, 10s).................................. +300°C
Soldering Temperature (reflow)........................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics (Note 1)
TQFN
Junction-to-Ambient Thermal Resistance (θJA)...........29°C/W
Junction-to-Case Thermal Resistance (θJC)...............1.7°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Electrical Characteristics
(VCC = +5V ±5%, TA = -40°C to +85°C, unless otherwise noted. Typical values are at VCC = +5V, TA = +25°C.) (Note 2)
PARAMETER
POWER SUPPLY
Quiescent Current
SYMBOL
CONDITIONS
IQ
VCC = 5.25V, VEN1 = VEN2 = VCC, REF
unconnected
MIN TYP MAX
50 150
Operating Current
HSYNC0 = 50kHz, VSYNC0 = 60Hz 10%
ICC duty cycle, RL on SYNC outputs = 2kΩ, REF
unconnected
1.5 2.7
5V SWITCH (S5V1, S5V2 OUTPUTS)
S5V_ Voltage Drop
VS5V
Reverse Leakage Current
IL
Pulldown Resistor
Output Current Limit
Thermal-Shutdown Threshold
Thermal-Shutdown Hysteresis
RS5V1,
RS5V2
ILIM
TSHDN
TSHDN_
HYS
IOUT = 55mA
VCC = 0V, VEN1 = VEN2 = 0V, VS5V1 =
VS5V2 = 5.25V, no load on S5V1 or S5V2
VS5V1 = VS5V2 = 1V, VEN1 = VEN2 = VCC
0.3
10
250
55 300 500
+150
25
UNITS
µA
mA
V
µA
mA
°C
°C
www.maximintegrated.com
Maxim Integrated 2


Part Number MAX14983E
Description Enhanced 1:2 VGA Mux
Maker Maxim Integrated
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MAX14983E Datasheet PDF






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