±15kV ESD-Protected, High-Drive Current,
Dual-/Quad-/Octal-Level Translators with
The MAX3394E/MAX3395E/MAX3396E bidirectional level
translators provide level shifting required for data transfer
in a multivoltage system. Internal slew-rate enhancement
circuitry features 10mA current-sink and 15mA current-
source drivers to isolate capacitive loads from lower current
drivers. In open-drain systems, slew-rate enhancement
enables fast data rates with larger pullup resistors and
increased bus load capacitance. Externally applied volt-
ages, VCC and VL, set the logic-high levels for the device.
A logic-low signal on one I/O side of the device appears as
a logic-low signal on the opposite I/O side, and vice-versa.
Each I/O line is pulled up to VCC or VL by an internal pullup
resistor, allowing the devices to be driven by either push-
pull or open-drain drivers.
The MAX3394E/MAX3395E/MAX3396E feature a tri-
state output mode, thermal-shutdown protection, and
±15kV Human Body Model (HBM) ESD protection on the
VCC side for greater protection in applications that route
The MAX3394E/MAX3395E/MAX3396E accept VCC volt-
ages from +1.65V to +5.5V, and VL voltages from +1.2V
to VCC, making them ideal for data transfer between low
voltage ASIC/PLDs and higher voltage systems. The
MAX3394E/MAX3395E/MAX3396E operate at a guaran-
teed data rate of 6Mbps with push-pull drivers and 1Mbps
with open-drain drivers.
The MAX3394E is a dual-level translator available in
9-bump UCSP™ and 8-pin 3mm x 3mm TDFN packages.
The MAX3395E is a quad-level translator available in
12-bump UCSP, and 12-pin 4mm x 4mm TQFN packag-
es. The MAX3396E is an octal-level translator available in
20-bump UCSP and 20-pin 5mm x 5mm TQFN packages.
The MAX3394E/MAX3395E/MAX3396E operate over the
extended -40°C to +85°C temperature range.
●● Multivoltage Bidirectional Level Translation
●● SPI™, MICROWIRE™, and I2C Level Translation
●● Open-Drain Rise-Time Speed-Up
●● High-Speed Bus Fan-Out Expansion
●● Cell Phones
●● Telecom, Networking, Servers, RAID/SAN
MICROWIRE is a trademark of National Semiconductor Corp.
SPI is a trademark of Motorola, Inc.
UCSP is a trademark of Maxim Integrated Products, Inc.
●● ±15kV ESD Protection on I/O VCC_ Lines
●● Bidirectional Level Translation Without Direction Pin
●● I/O VL_ and I/O VCC_ 10mA Sink-/15mA Source-
●● Slew-Rate Enhancement Circuitry Supports
●● Larger Capacitive Loads or Larger External Pullup
●● 6Mbps Push-Pull/1Mbps Open-Drain Guaranteed
●● Wide Supply-Voltage Range: Operation Down to
+1.2V on VL and +1.65V on VCC
●● Low Supply Current in Tri-State Output Mode
●● Low Quiescent Current
●● Thermal-Shutdown Protection
●● UCSP, TDFN, and TQFN Packages
MAX3394EETA+T 8 TDFN-EP**
MAX3394EEBL+T 9 UCSP
MAX3395EEBC+T 12 UCSP
MAX3396EEBP+T* 20 UCSP
MAX3396EETP+* 20 TQFN-EP**
Note: All devices specified over the -40°C to +85°C operating
+Denotes lead(Pb)-free/RoHS-compliant package.
*Future product—contact factory for availability.
**EP = Exposed paddle.
Selector Guide appears at end of data sheet.
(LEADS ON BOTTOM)
*CONNECT EXPOSED PAD TO GROUND
Pin Configurations continued at end of data sheet.
19-3884; Rev 3; 7/17