Description
This device provides a bidirectional, half-duplex communication, physical interface to automotive and industrial LIN systems to meet the LIN Bus Specification Revision 2.2, SAE J2602, and ISO 17987.
Features
- The MCP2003B is Compliant with Local Interconnect Network (LIN) Bus Specifications 1.3, 2.0, 2.1, 2.2, SAE J2602, and ISO17987.
- Supports Baud Rates up to 20 Kbaudwith LIN-Compatible Output Driver.
- 60V Load Dump Protected.
- Very High Electromagnetic Immunity (EMI) Meets Stringent Original Equipment Manufacturers (OEM) Requirements.
- Direct Capacitor Coupling Robustness without Transient Voltage Suppressor (TVS):
- ±35V on LBUS (SAE J2962-1)
- ±85V on L.
MCP2003B-Microchip.pdf
